Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing: Difference between revisions
| Line 119: | Line 119: | ||
|29/4 2015 | |29/4 2015 | ||
|taran | |taran | ||
|9 points on one wafer, exclusion zone 5mm | |9 points on one wafer, exclusion zone 5mm <br> Non-vacuum chuck | ||
|} | |} | ||