Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing: Difference between revisions
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==AZ MiR 701== | ==AZ MiR 701== | ||
[[Image:RCD8 AZ 4562.jpg|300x300px|thumb|right|Spin curve for AZ 4562]] | [[Image:RCD8 AZ 4562.jpg|300x300px|thumb|right|Spin curve for AZ 4562]] | ||
Spin coating of AZ | Spin coating of AZ MiR 701 (29cps) on Spin Coater: RCD8 using manual dispense is a very simple process. The wafer is accelerated at 1000rpm/s to the spin-off speed, spun for 30s, then decelerated at 1000rpm/s. | ||
''Recipe names, process parameters, and test results:'' | ''Recipe names, process parameters, and test results:'' | ||
*'''1 DCH | *'''1 DCH MiR 701 man disp 2um''' | ||
Spin-off: 30 s at | Spin-off: 30 s at 2350 rpm. | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
|Silicon with native oxide | |Silicon with native oxide | ||
| | |2.00 µm | ||
| | |1.8% | ||
|29/4 2015 | |29/4 2015 | ||
|taran | |taran | ||
|9 points on one wafer, exclusion zone 5mm | |9 points on one wafer, exclusion zone 5mm <br> Non-vacuum chuck | ||
|} | |} | ||