Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing: Difference between revisions
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==AZ 5214E== | ==AZ 5214E== | ||
[[Image:RCD8 AZ 5214E.jpg|300x300px|thumb|right|Spin curve for AZ 5214E]] | |||
Spin coating of AZ 5214E on Spin Coater: RCD8 using manual dispense is a very simple process. The wafer is accelerated at 1000rpm/s to the spin-off speed, spun for 30s, then decelerated at 1000rpm/s. | Spin coating of AZ 5214E on Spin Coater: RCD8 using manual dispense is a very simple process. The wafer is accelerated at 1000rpm/s to the spin-off speed, spun for 30s, then decelerated at 1000rpm/s. | ||