Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing: Difference between revisions
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Spin coating of AZ 5214E on Spin Coater: RCD8 using manual dispense is a very simple process. The wafer is accelerated at 1000rpm/s to the spin-off speed, spun for 30s, then decelerated at 1000rpm/s. | Spin coating of AZ 5214E on Spin Coater: RCD8 using manual dispense is a very simple process. The wafer is accelerated at 1000rpm/s to the spin-off speed, spun for 30s, then decelerated at 1000rpm/s. | ||
'' | ''Recipe names, process parameters, and test results:'' | ||
*'''1 DCH 5214E man disp 1.5um''' | *'''1 DCH 5214E man disp 1.5um''' | ||
Spin-off: 30 s at 4700 rpm. '''OBS!''' ''Do not use with non-vacuum chuck!'' | Spin-off: 30 s at 4700 rpm. '''OBS!''' ''Do not use with non-vacuum chuck!'' | ||