Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing: Difference between revisions
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==AZ 5214E== | ==AZ 5214E== | ||
Spin coating of AZ 5214E on Spin Coater: RCD8 using manual dispense is a very simple process. | Spin coating of AZ 5214E on Spin Coater: RCD8 using manual dispense is a very simple process. The wafer is accelerated at 1000rpm/s to the spin-off speed, spun for 30s, then decelerated at 1000rpm/s. | ||
''Flow names, process parameters, and test results:'' | ''Flow names, process parameters, and test results:'' | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
|Silicon with native oxide | |Silicon with native oxide | ||
|1. | |1.52 µm | ||
|0.3% | |0.3% | ||
|21/4 2015 | |21/4 2015 | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
|Silicon with native oxide | |Silicon with native oxide | ||
|2. | |2.19 µm | ||
|0.4% | |0.4% | ||
|22/4 2013 | |22/4 2013 | ||