Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing: Difference between revisions
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==AZ 5214E== | ==AZ 5214E== | ||
*1 DCH 5214E man disp 1.5um | Spin coating of AZ 5214E on Spin Coater: RCD8 using manual dispense is a very simple process. | ||
*1 DCH 5214E man disp 2.2um | |||
''Flow names, process parameters, and test results:'' | |||
*'''1 DCH 5214E man disp 1.5um''' | |||
Spin-off: 30 s at 4700 rpm. OBS! Do not us with non-vacuum chuck! | |||
{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;" | |||
|- | |||
|-style="background:silver; color:black" | |||
!Substrate | |||
!Thickness | |||
!Uniformity (+/-) | |||
!Test date | |||
!Tester initials | |||
!Comments | |||
|- | |||
|-style="background:WhiteSmoke; color:black" | |||
|Silicon with native oxide | |||
|1.516µm | |||
|0.3% | |||
|21/4 2015 | |||
|taran | |||
|9 points on one wafer, exclusion zone 5mm | |||
|} | |||
*'''1 DCH 5214E man disp 2.2um''' | |||
Spin-off: 30 s at 2100 rpm. | |||
{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;" | |||
|- | |||
|-style="background:silver; color:black" | |||
!Substrate | |||
!Thickness | |||
!Uniformity (+/-) | |||
!Test date | |||
!Tester initials | |||
!Comments | |||
|- | |||
|-style="background:WhiteSmoke; color:black" | |||
|Silicon with native oxide | |||
|2.19µm | |||
|0.4% | |||
|22/4 2013 | |||
|taran | |||
|9 points on one wafer, exclusion zone 5mm | |||
|} | |||
=Template recipes= | =Template recipes= | ||