Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions
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===Wafer temperature=== | ===Wafer temperature=== | ||
The wafer temperature during e-beam deposition of 200 nm Au on six wafers has been measured using thermal labels on the backside of the wafers. The following results were obtained: | |||
==Equipment performance and and process related parameters Wordentec== | ==Equipment performance and and process related parameters Wordentec== | ||