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Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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'''The user manual(s), quality control procedure(s) and results and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=44 LabManager].'''
'''The user manual(s), quality control procedure(s) and results and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=44 LabManager].'''
===Process information===
The KS Aligner has an i-line notch filter installed. This results in an exposure light peak around 365nm with a FWHM of 7nm. Dependent on the spectral sensitivity of the resist, the optimal dose may be increased compared to broadband exposure on the Aligner-6inch.
*[[Specific Process Knowledge/Lithography/UVExposure/UVExposure dose|Information on UV exposure dose]]
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==Aligner: MA6 - 2==
This section is under construction [[Image:section under construction.jpg|70px]]
[[Image:KSaligner.jpg|300x300px|thumb|The KSaligner MA6 is placed in C-1]]
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/UVExposure#KS_Aligner click here]'''
SUSS Mask Aligner MA6 is designed for high resolution photolithography.
The 365nm exposure wavelength version is capable of 1.25 (1.0) um resolution in vacuum contact. All contact exposure programs (vacuum, hard, soft, proximity) are supplied.
Two alignment options are available: top side alignment (TSA) with a split field or a video microscope and back side alignment (BSA) with BSA microscope. It is also possible to make IR- light alignment.
'''The user manual(s), quality control procedure(s) and results and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=339 LabManager].'''


===Process information===
===Process information===