Specific Process Knowledge/Thin film deposition: Difference between revisions

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[[/Deposition of Silicon Oxide|Silicon Oxide]]<br/>
[[/Deposition of Silicon Oxide|Silicon Oxide]]<br/>
[[/Deposition of Titanium Oxide|Titanium Oxide]]<br/>
[[/Deposition of Titanium Oxide|Titanium Oxide]]<br/>
[[/Lesker|Alumina (Al2O3, Aluminium Oxide)]]<br/>
[[/Lesker|Tantalum (Ta2O5, Tantalum pentoxide)]]<br/>
[[/Lesker|Cromia (Cr2O3, Chromium Oxide)]]<br/>
|style="background: #DCDCDC"|
|style="background: #DCDCDC"|
[[/Deposition of Silicon|Silicon]] <br/>
[[/Deposition of Silicon|Silicon]] <br/>
[[/Deposition of Germanium|Germanium]]
[[/Deposition of Germanium|Germanium]]
[[/Lesker|Zinc Oxide (ZnO)]]<br/>
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|style="background: LightGray"|
[[/Deposition of Aluminium|Aluminium]] <br/>
[[/Deposition of Aluminium|Aluminium]] <br/>
[[/Deposition of Titanium|Titanium]]<br/>
[[/Deposition of Titanium|Titanium]]<br/>
[[/Deposition of Chromium|Chromium]]<br/>
[[/Deposition of Chromium|Chromium]]<br/>
[[/Lesker|Cobalt]]<br/>
[[/Deposition of Nickel|Nickel]]<br/>
[[/Deposition of Nickel|Nickel]]<br/>
[[/Deposition of Copper|Copper]]<br/>
[[/Deposition of Copper|Copper]]<br/>
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[[/Deposition of Platinum|Platinum]]<br/>
[[/Deposition of Platinum|Platinum]]<br/>
[[/Deposition of Gold|Gold]]<br/>
[[/Deposition of Gold|Gold]]<br/>
[[/Lesker|Iron]]<br/>
[[/Lesker|Magnesium]]<br/>
[[/Lesker|Niobium]]<br/>
[[/Lesker|Ruthenium]]<br/>
[[/Lesker|/Lesker]]<br/>
[[/Lesker|Cobalt]]<br/>
[[/Lesker|Cobalt]]<br/>
[[/Lesker|Cobalt]]<br/>
|style="background: #DCDCDC"|
|style="background: #DCDCDC"|
[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>
[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>
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[[/Deposition of AlTi|AlTi]] alloy <br/>
[[/Deposition of AlTi|AlTi]] alloy <br/>
[[/Deposition of NiV|NiV]] alloy
[[/Deposition of NiV|NiV]] alloy
[[/Lesker|AlCu]]<br/>
[[/Lesker|CoFe]]<br/>
[[/Lesker|CuTi]]<br/>
[[/Lesker|FeMn]]<br/>
[[/Lesker|MnIr]]<br/>
[[/Lesker|NiCo]]<br/>
[[/Lesker|NiFe]]<br/>
[[/Lesker|Cobalt]]<br/>
[[/Lesker|Cobalt]]<br/>
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|style="background: LightGray"|
ITO
ITO

Revision as of 09:32, 5 November 2014

3rd Level - Material/Method

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Choose material to deposit

Dielectrica Semicondutors Metals Alloys Transparent conductive oxides Polymers

Silicon Nitride - and oxynitride
Silicon Oxide
Titanium Oxide
Alumina (Al2O3, Aluminium Oxide)
Tantalum (Ta2O5, Tantalum pentoxide)
Cromia (Cr2O3, Chromium Oxide)

Silicon
Germanium Zinc Oxide (ZnO)

Aluminium
Titanium
Chromium
Cobalt
Nickel
Copper
Molybdenum
Palladium
Silver
Tin
Tantalum
Tungsten
Platinum
Gold
Iron
Magnesium
Niobium
Ruthenium
/Lesker
Cobalt
Cobalt
Cobalt

TiW alloy (10%/90% by weight)
NiCr alloy
AlTi alloy
NiV alloy AlCu
CoFe
CuTi
FeMn
MnIr
NiCo
NiFe
Cobalt
Cobalt

ITO

SU8
Antistiction coating
Topas
PMMA

Choose deposition equipment

PVD LPCVD PECVD ALD Coaters Others


See the Lithography/Coaters page for coating polymers

  • MVD - Molecular Vapor Deposition
  • Electroplating-Ni - Electrochemical deposition of nickel
  • MOCVD - Epitaxial growth - Ask the department of photonics