Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy/Workspaces

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Roughness measurements High aspect ratio samples Steep steps - but no high aspect ratio Topographic measurement with no or very small steps (<?)

Comparison method 1 and method 2 for the process

	Roughness measurements	Topographic measurements with no steep steps	Steep steps but no high aspect ratio	High aspect ratio measurements
Recommended mode	Roughness measurement can be done in both Contact, Tapping and ScanAsyst mode. We recommend ScanAsyst mode because of less chance of (non-uniform) deformation of the sample and less tip wear - and because of ease of use.	For Topographic measurements with no steep steps we also recommend ScanAsyst mode due to less chance of (non-uniform) deformation of the sample and less tip wear - and because of ease of use.	For Steep steps but no high aspect ratio structures we still recommend ScanAsyst mode but it will go slower than Tapping mode.	For High aspect ratio measurements we recommend Tapping mode. There is not yet a ScanAsyst probe developed for high aspect ratio. Therefor we recommend Tapping mode.
Recommended probes	ScanAsyst in air	ScanAsyst in air	ScanAsyst in air for ScanAsyst mode TAP300Al-G for Tapping mode	AR5T-NCH FIB6
Recommended experiment/Workspace	ScanAsyst in air - roughness (<10nm)	ScanAsyst in air - standards	ScanAsyst in air - steep steps	Tapping mode in air 300nm (for steps <~1µm) Tappping mode in air 6µm (for steps >1~µm)
Substrate size	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers
Allowed materials	Allowed material 1 Allowed material 2	Allowed material 1 Allowed material 2 Allowed material 3