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Revision as of 13:22, 12 June 2014
2nd Level - Process Topic
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Choose the process topic you are interested in
The section below here is under construction 
Overview of sample processing
| Make a layer on the sample or Film Formation File:Making a layer 1.jpg
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| Thermal Oxide growth
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| Physical Vapour Deposition
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Sputter deposition
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Thermal deposition
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E-beam evaporation
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| CVD
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LPCVD
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PECVD
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| Coating
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Spin coating
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Spray coating
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| Electroplating
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| Epitaxial growth
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Make a mask on the sample 
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| Lithography
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| Imprinting
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| Transfer pattern into the sample
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| Wet etch
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| Dry etch
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| Lift-off
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| Direct structure definition
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| Imprinting
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| LASER machining
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| Lithographic definition
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| Polymer Injection molding
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| Back end of the sample
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| Chip/die mounting
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| Wire bonding
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| Dicing
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Overview of sample processing 2
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| File:Making a layer 1.jpgFilm Formation
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| Thermal Oxide growth
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| Thin Film deposition
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Sputter deposition
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Thermal deposition
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E-beam evaporation
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| CVD
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LPCVD
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PECVD
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| Coating
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Spin coating
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Spray coating
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| Electroplating
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| Epitaxial growth
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 Make a mask on the sample
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| Lithography
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| Imprinting
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| Transfer pattern into the sample
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| Wet etch
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| Dry etch
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| Lift-off
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| Direct structure definition
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| Imprinting
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| LASER machining
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| Lithographic definition
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| Polymer Injection molding
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| Back end of the sample
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| Chip/die mounting
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| Wire bonding
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| Dicing
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Overview of sample processing 3
| Create a layer/film on your sample
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| Entry page in LabAdviser
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Techniques
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Materials
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| Thermal Oxide growth
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Furnaces
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SiO2
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| Thin film deposition
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Sputter deposition
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Si,SiO2,Si3N3,TiO2, metals
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Thermal evaporation
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Al, ?
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E-beam evaporation
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Metals
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LPCVD
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Si3N4, SRN, SiO2, Si (poly and amorph)
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PECVD
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Si3N4, SiO2, PBSG
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Electroplating
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Ni
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| Coating
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Spin coating
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resists, polymers
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Spray coating
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resists, polymers
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| Epitaxial growth
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MOCVD
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| Thermal treatment of your sample
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| Make a mask on your sample
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| Entry page in LabAdviser
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Techniques
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| Lithography
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Photolithography
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Deep UV lithography
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E-beam lithography
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Imprinting
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| Transfer mask pattern to your sample
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| Wet etch
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| Dry etch
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| Lift-off
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| Direct structure definition on your sample
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| Imprinting
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| LASER machining
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| Lithographic definition
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| Polymer Injection molding
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| Bonding your samples together
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| Back end processing of your sample
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| Chip/die mounting
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| Wire bonding
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| Dicing
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