Specific Process Knowledge: Difference between revisions
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2nd Level - Process Topic
The section below here is under construction
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! Bonding samples together | ! Bonding your samples together | ||
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! Characterize | ! Characterize your sample | ||
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Revision as of 13:44, 12 June 2014
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Choose the process topic you are interested in
The section below here is under construction 
Overview of sample processing
Clean the sample 
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Drying Samples 
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Make a layer on the sample or Film Formation 
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| Thermal Oxide growth | |
| Physical Vapour Deposition | |
| Sputter deposition | |
| Thermal deposition | |
| E-beam evaporation | |
| CVD | |
| LPCVD | |
| PECVD | |
| Coating | |
| Spin coating | |
| Spray coating | |
| Electroplating | |
| Epitaxial growth |
Thermal treatment of the sample 
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Make a mask on the sample 
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| Lithography |
| Imprinting |
| Transfer pattern into the sample |
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| Wet etch |
| Dry etch |
| Lift-off |
| Direct structure definition |
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| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bonding samples together |
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| Characterize the sample |
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| Back end of the sample |
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| Chip/die mounting |
| Wire bonding |
| Dicing |
Overview of sample processing 2
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Overview of sample processing 3
| Clean your sample |
|---|
| Drying your Samples |
|---|
| Create a layer/film on your sample | |
|---|---|
| Thermal Oxide growth | |
| Physical Vapour Deposition | |
| Sputter deposition | |
| Thermal deposition | |
| E-beam evaporation | |
| CVD | |
| LPCVD | |
| PECVD | |
| Coating | |
| Spin coating | |
| Spray coating | |
| Electroplating | |
| Epitaxial growth |
| Thermal treatment of your sample |
|---|
| Make a mask on your sample |
|---|
| Lithography |
| Imprinting |
| Transfer mask pattern to your sample |
|---|
| Wet etch |
| Dry etch |
| Lift-off |
| Direct structure definition on your sample |
|---|
| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bonding your samples together |
|---|
| Characterize your sample |
|---|
| Back end processing of your sample |
|---|
| Chip/die mounting |
| Wire bonding |
| Dicing |