Specific Process Knowledge: Difference between revisions
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==Overview of sample processing== | |||
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! Clean the sample [[File:cleaning.jpg|50px]] | |||
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! Drying Samples [[File:drying.jpg|50px]] | |||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! Make a layer on the sample or Film Formation [[File:Making a layer 1.jpg|40px]] | |||
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|Thermal Oxide growth | |||
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|Physical Vapour Deposition | |||
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|Sputter deposition | |||
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|Thermal deposition | |||
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|E-beam evaporation | |||
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|CVD | |||
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|LPCVD | |||
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|PECVD | |||
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|Coating | |||
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|Spin coating | |||
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|Spray coating | |||
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|Electroplating | |||
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|Epitaxial growth | |||
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! Thermal treatment of the sample [[File:Thermal treatment 1.jpg|50px]] | |||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! Make a mask on the sample [[File:Making a mask 1.jpg|40px]] | |||
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|Lithography | |||
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|Imprinting | |||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! Transfer pattern into the sample | |||
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|Wet etch | |||
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|Dry etch | |||
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|Lift-off | |||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! Direct structure definition | |||
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|Imprinting | |||
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|LASER machining | |||
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|Lithographic definition | |||
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|Polymer Injection molding | |||
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! Bonding samples together | |||
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! Characterize the sample | |||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! Back end of the sample | |||
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|Chip/die mounting | |||
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|Wire bonding | |||
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|Dicing | |||
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Revision as of 12:25, 12 June 2014
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Overview of sample processing
| Clean the sample File:Cleaning.jpg |
|---|
| Drying Samples File:Drying.jpg |
|---|
| Make a layer on the sample or Film Formation File:Making a layer 1.jpg | |
|---|---|
| Thermal Oxide growth | |
| Physical Vapour Deposition | |
| Sputter deposition | |
| Thermal deposition | |
| E-beam evaporation | |
| CVD | |
| LPCVD | |
| PECVD | |
| Coating | |
| Spin coating | |
| Spray coating | |
| Electroplating | |
| Epitaxial growth |
| Thermal treatment of the sample File:Thermal treatment 1.jpg |
|---|
| Make a mask on the sample |
|---|
| Lithography |
| Imprinting |
| Transfer pattern into the sample |
|---|
| Wet etch |
| Dry etch |
| Lift-off |
| Direct structure definition |
|---|
| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bonding samples together |
|---|
| Characterize the sample |
|---|
| Back end of the sample |
|---|
| Chip/die mounting |
| Wire bonding |
| Dicing |
Overview of sample processing 2
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Overview of sample processing
| Clean the sample File:Cleaning.jpg |
|---|
| Drying Samples File:Drying.jpg |
|---|
| Make a layer on the sample or Film Formation File:Making a layer 1.jpg | |
|---|---|
| Thermal Oxide growth | |
| Physical Vapour Deposition | |
| Sputter deposition | |
| Thermal deposition | |
| E-beam evaporation | |
| CVD | |
| LPCVD | |
| PECVD | |
| Coating | |
| Spin coating | |
| Spray coating | |
| Electroplating | |
| Epitaxial growth |
| Thermal treatment of the sample File:Thermal treatment 1.jpg |
|---|
| Make a mask on the sample |
|---|
| Lithography |
| Imprinting |
| Transfer pattern into the sample |
|---|
| Wet etch |
| Dry etch |
| Lift-off |
| Direct structure definition |
|---|
| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bonding samples together |
|---|
| Characterize the sample |
|---|
| Back end of the sample |
|---|
| Chip/die mounting |
| Wire bonding |
| Dicing |
