Specific Process Knowledge: Difference between revisions

← Older edit Newer edit →

VisualWikitext

Revision as of 08:27, 12 June 2014

2nd Level - Process Topic

Feedback to this page: click here

Choose the process topic you are interested in

Back-end processing

Characterization

E-beam lithography

Etch

Imprinting

Lithography

Thermal Process

Thin film deposition

Wafer and sample drying

Wafer Bonding

Wafer Cleaning

Wafer Information

III-V Process

The section below here is under construction

Overview of sample processing

Clean the sample

Drying Samples

Make a layer on the sample or Film Formation
Thermal Oxide growth
Thin Film deposition
	Sputter deposition
	Thermal deposition
	E-beam evaporation
CVD
	LPCVD
	PECVD
Coating
	Spin coating
	Spray coating
Electroplating
Epitaxial growth

Thermal treatment of the sample

Make a mask on the sample
Lithography
Imprinting

Transfer pattern into the sample
Wet etch
Dry etch
Lift-off

Direct structure definition
Imprinting
LASER machining
Lithographic definition
Polymer Injection molding

Bonding samples together

Characterize the sample

Back end of the sample
Chip/die mounting
Wire bonding
Dicing

Overview of sample processing 2

Clean the sample

Drying Samples

Film Formation
Thermal Oxide growth
Thin Film deposition
	Sputter deposition
	Thermal deposition
	E-beam evaporation
CVD
	LPCVD
	PECVD
Coating
	Spin coating
	Spray coating
Electroplating
Epitaxial growth

Thermal treatment of the sample

Make a mask on the sample
Lithography
Imprinting

Transfer pattern into the sample
Wet etch
Dry etch
Lift-off

Direct structure definition
Imprinting
LASER machining
Lithographic definition
Polymer Injection molding

Bonding samples together

Characterize the sample

Back end of the sample
Chip/die mounting
Wire bonding
Dicing

@@ Line 140: / Line 140: @@
 ==Overview of sample processing 2==
+{| {{Table}}
+|
 {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
 ! [[image:cleaning.jpg|thumb|150px|Clean the sample]]
 |}
+|
 {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
 ! [[image:drying.jpg|thumb|150px|Drying Samples ]]
 |}
+|
 {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
 ! [[image:Making a layer 1.jpg|thumb|140px|Film Formation ]]
@@ Line 190: / Line 193: @@
 |-
 |}
+|
 {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
-! Thermal treatment of the sample [[File:Thermal treatment 1.jpg|50px]]
+! [[image:Thermal treatment 1.jpg|thumb|150px|Thermal treatment of the sample ]]
 |}
+|-
+|
 {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
-! Make a mask on the sample [[File:Making a mask 1.jpg|40px]]
+! [[image:Making a mask 1.jpg|thumb|140px|Make a mask on the sample ]]
 |-
 |Lithography
@@ Line 202: / Line 207: @@
 |-
 |}
+|
 {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
 ! Transfer pattern into the sample
@@ Line 212: / Line 218: @@
 |-
 |}
+|
 {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
 ! Direct structure definition
@@ Line 224: / Line 231: @@
 |-
 |}
+|
 {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
 ! Bonding samples together
 |}
+|-
+|
 {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
 ! Characterize the sample
 |}
+|
 {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
 ! Back end of the sample
@@ Line 238: / Line 249: @@
 |-
 |Dicing
+|-
+|}
+|
+|
 |-
 |}