Specific Process Knowledge: Difference between revisions
Line 45: | Line 45: | ||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | ||
!Make a layer on the sample [[File:Making a layer 1.jpg| | !Make a layer on the sample [[File:Making a layer 1.jpg|40px]] | ||
! | ! | ||
|- | |- | ||
Line 90: | Line 90: | ||
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | ||
!Thermal treatment of the sample | !Thermal treatment of the sample [[File:Thermal treatment 1.jpg|50px]] | ||
|} | |} | ||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" |
Revision as of 14:46, 27 May 2014
Feedback to this page: click here
Choose the process topic you are interested in
The section beneath is under construction
Overview of sample processing
Clean the sample |
---|
Drying Samples |
---|
Thermal treatment of the sample |
---|
Make a mask on the sample | |
---|---|
Lithography | |
Imprinting |
Transfer pattern into the sample |
---|
Wet etch |
Dry etch |
Lift-off |
Direct structure definition |
---|
Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Bonding samples together |
---|
Characterize the sample |
---|
Back end of the sample |
---|
Chip/die mounting |
Wire bonding |
Dicing |