Specific Process Knowledge/Lithography/Development: Difference between revisions

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 ==Developer-TMAH==
 [[Image:KSspinner.JPG|300×300px|right|thumb|Developer-TMAH is located in C-1]]
+'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer-TMAH click here]'''
+Developer-TMAH is a manually operated, single substrate spray-puddle developer. It uses the TMAH based AZ 726 MIF developer (2.38 % TMAH in  water with a small amount of wetting agent). The substrates are loaded manually one by one into the developer. Developer dispense, puddle time, and a rough water rinse is performed automatically by the equipment.
+'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 LabManager]'''
+===Process information===
+'''Standard process recipes'''
+*nLoF_40x2: double puddle, 40s. For development of AZ nLOF 2020 resist.
+*MiR701 60s: single puddle, 60s. For development of AZ MiR 701 resist.
+*DUV 60s: single puddle, 60s. For development of DUV resists.
+'''Utility recipes'''
+*UTIL-DR: Dome rinse.
+*UTIL-BE: Bottle change. Danchip use only.
+=== Equipment performance and process related parameters ===
+{| border="2" cellspacing="0" cellpadding="2"
+!style="background:silver; color:black;" align="center" width="60"|Purpose
+|style="background:LightGrey; color:black"|
+|style="background:WhiteSmoke; color:black"|
+Development of
+*AZ nLOF
+*AZ MiR 701
+*AZ 5214E
+*AZ 4562
+*DUV resists
+|-
+!style="background:silver; color:black;" align="center" width="60"|Developer
+|style="background:LightGrey; color:black"|
+|style="background:WhiteSmoke; color:black" align="center"|
+AZ 726 MIF
+(2.38% TMAH in water)
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
+|style="background:LightGrey; color:black"|
+|style="background:WhiteSmoke; color:black" align="center"|
+Puddle
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
+|style="background:LightGrey; color:black"|Temperature
+|style="background:WhiteSmoke; color:black" align="center"|
+Room temperature
+|-
+|style="background:LightGrey; color:black"|Agitation
+|style="background:WhiteSmoke; color:black" align="center"|
+none
+|-
+|style="background:LightGrey; color:black"|Rinse
+|style="background:WhiteSmoke; color:black" align="center"|
+DI water
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
+|style="background:LightGrey; color:black"|Substrate size
+|style="background:WhiteSmoke; color:black" align="center"|
+* 100 mm wafers
+* 150 mm wafers
+|-
+| style="background:LightGrey; color:black"|Allowed materials
+|style="background:WhiteSmoke; color:black" align="center"|
+Silicon, glass, and polymer substrates
+Film or pattern of all types
+|-
+|style="background:LightGrey; color:black"|Batch
+|style="background:WhiteSmoke; color:black" align="center"|
+|-
+|}
+<br clear="all" />
+==Developer robot: TMAH==
+[[Image:KSspinner.JPG|300x300px|right|thumb|Developer robot: TMAH is located in C-1]]
 '''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer-TMAH click here]'''