Specific Process Knowledge/Thin film deposition: Difference between revisions

Revision as of 14:12, 27 March 2014

3rd Level - Material/Method

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Choose material to deposit

Dielectrica	Semicondutors	Metals	Alloys	Polymers
Silicon Nitride - and oxynitride Silicon Oxide Titanium Oxide	Silicon Germanium	Aluminium Titanium Chromium Nickel Copper Molybdenum Palladium Silver Tin Tantalum Tungsten Platinum Gold	TiW alloy (10%/90% by weight) NiCr alloy AlTi alloy NiV alloy	SU8 Antistiction coating Topas PMMA

Choose deposition equipment

PVD	LPCVD	PECVD	ALD	Coaters	Others
Alcatel - E-beam evaporator and sputter tool Lesker - Sputter tool PVD co-sputter/evaporation - E-beam evaporator and multiple wafer tool Wordentec - E-beam evaporator, sputter and thermal evaporator Physimeca - E-beam evaporator (III-V lab) IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching Sputter coater Hummer - Gold sputtering system Balzer Sputter coater - Gold sputtering system	Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride Furnace LPCVD Polysilicon (4" and 6") Deposition of polysilicon Furnace LPCVD TEOS (4") - Deposition of silicon oxide	PECVD - Plasma Enhanced Chemical Vapor deposition Black Magic PECVD - Black Magic PECVD (Carbon)	ALD Picosun R200 - Atomic layer deposition	See the Lithography/Coaters page for coating polymers	MVD - Molecular Vapor Deposition Electroplating-Ni - Electrochemical deposition of nickel

@@ Line 54: / Line 54: @@
 | align="left" valign="top" style="background:#DCDCDC;"|''' LPCVD'''
 | align="left" valign="top" style="background:LightGray"|''' PECVD'''
-| align="left" valign="top" style="background:#DCDCDC;"|''' Coaters'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' ALD'''
-| align="left" valign="top" style="background:LightGray"|''' Others'''
+| align="left" valign="top" style="background:LightGray"|''' Coaters'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' Others'''
 |-valign="top"
@@ Line 69: / Line 72: @@
 |style="background: #DCDCDC"|
 *[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Silicon_Nitride/Deposition_of_Silicon_Nitride_using_LPCVD|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride''
-*[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] - ''Deposition of polysilicon''
+*[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] ''Deposition of polysilicon''
 *[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide''
 |style="background: LightGray"|
@@ Line 75: / Line 78: @@
 *[[/Black Magic PECVD|Black Magic PECVD]] - ''Black Magic PECVD (Carbon)''
 |style="background: #DCDCDC"|
+*[[ALD Picosun R200|ALD Picosun R200]] - Atomic layer deposition
+|style="background: LightGray"|
 See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers
-|style="background: LightGray"|
+|style="background: #DCDCDC"|
 *[[/MVD|MVD]] - ''Molecular Vapor Deposition''
 *[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel''
 |-
 |}