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Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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Chasil (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
547 edits
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|style="background:WhiteSmoke; color:black"|Mainly for patterning, milling or dicing substrate with micrometric shapes and above (>  10µm)
|style="background:WhiteSmoke; color:black"|Mainly for patterning, milling or dicing substrate with micrometric shapes and above (>  10µm)
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!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Performance
!style="background:silver; color:black" align="left" valign="top" rowspan="4"|Performances
|style="background:LightGrey; color:black"|Resolution
|style="background:LightGrey; color:black"|Resolution
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|style="background:LightGrey; color:black"|Scanning speed
|style="background:LightGrey; color:black"|Output power@100(laser IPG – nanosecond)
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|style="background:WhiteSmoke; color:black"|
*100MHz
Repetition rate : 100kHz
 
* 1064nm : 80W
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|style="background:LightGrey; color:black"|Min. electron beam size
!style="background:silver; color:black" align="left" valign="top" rowspan="1"|Substrates
|style="background:LightGrey; color:black"|Material allowed
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*5nm
* Silicon
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* Silicon + Si3N4 and/or SiO2
|style="background:LightGrey; color:black"|Min. step size
* Silicon with resist
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* Aluminum
*1nm
* Steel
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* Pyrex
|style="background:LightGrey; color:black"|Beam current range
* Fused silicate (quartz)
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* Topas
*0.1nA to 60nA in normal conditions (see available condition files <span class="plainlinks">[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=log&mach=292&type=status here]</span>)
 
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|style="background:LightGrey; color:black"|Dose range
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*0.001µC/cm<sup>2</sup> to 100000µC/cm<sup>2</sup>
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!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Samples
|style="background:LightGrey; color:black"|Batch size
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Wafer cassettes:
*6 x 2" wafers
*2 x 4" wafers
*1 x 6" wafer
*Special wafer cassette with slit openings of 20 mm (position A), 12 mm (position B), 8 mm (position C) and 4 mm (position D).
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| style="background:LightGrey; color:black"|Substrate material allowed
| style="background:LightGrey; color:black"|Substrate material allowed
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