Specific Process Knowledge/Back-end processing/Laser Micromachining Tool

Feedback to this page: click here

Laser Micromachining Tool

Lasertool microSTRUCT vario (3D-Micromac AG)

Inside lasertool

The Laser Micromachining Tool is a microSTRUCT vario from the company 3D-Micromac AG.

The machine is located in the basement of building 346 under the cleanroom.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager: [1]

It is equipped with 2 high power lasers:

• a 50W picosecond laser that can emit light at 3 wavelengths: 355nm, 532nm and 1064nm (Time-Bandwidth Products, Fuego/Duetto. See some details in this article: [2] ) with a pulse repetition rate from 200kHz up to 8000kHz.

  and a

• a 100W nanosecond laser with a wavelength of 1064nm (IPG Laser YLP-HP series) with a pulse repetition rate of 100kHz.

The system is able to produce micro structures in different kinds of materials like metals, ceramics, composite materials, etc. It can produce features down to ~10µm size over a large area. It can scan over an area of up to ~15x15cm without moving the sample. By moving the sample on the large x-y-stage this area can be extended by stitching.

The laser can use Autocad DXF files for the pattern design. To create these files we recommend to use Clewin 5. See more info here.

Technical specifications

• Spot size and optics

Frequency and wavelength

Picosecond 1064nm 532nm 355nm Frequency min 200 kHz 200 kHz 200 kHz Frequency max 8000 kHz 8000 kHz 8000 kHz Nanosecond 1064nm Frequency min 100kHz Frequency max 100kHz

Performances

Purpose	Patterning, milling and dicing substrates	Mainly for patterning, milling or dicing substrate with micrometric shapes and above (> 10µm)
Performance	Resolution	Down to 10µm with the blue laser (355nm). Depending on the depth wished.
	Maximum writing area	Depends of the optics. Max size : Blue (145x145mm) Green ( 165x165mm) Red (165x165mm)
	Output power @100%(laser TB width – picosecond)	100kV
Scanning speed	100MHz
Min. electron beam size	5nm
Min. step size	1nm
Beam current range	0.1nA to 60nA in normal conditions (see available condition files here)
Dose range	0.001µC/cm2 to 100000µC/cm2
Samples	Batch size	Wafer cassettes: 6 x 2" wafers 2 x 4" wafers 1 x 6" wafer Special wafer cassette with slit openings of 20 mm (position A), 12 mm (position B), 8 mm (position C) and 4 mm (position D).
	Substrate material allowed	Silicon, quartz, pyrex, III-V materials Wafers with layers of silicon oxide or silicon (oxy)nitride Wafers with layers of metal

Process information

Result from the acceptance test

• Results from Laser Micromachining Tool acceptance test

Laser results details

• Silicon cutting and milling
• Borofloat glass cutting and milling
• Quartz cutting and milling
• Aluminium cutting and milling
• Nickel cutting and milling (for Polymer Injection Molder)
• Mask making

Laser Processing details

Material

Optics

Frequency

Intensity

Power measured @10%

Writing speed

Number of burst

Number of Z-offset

Number of iteration

Number of parallel lines

Gap in between line

Parameter file

Comments

Silicon 525µm

Green(532nm/255mm)

200 kHz

100%

0,57 W

50 mm/s

1 burst

none

4

1

N/A

Silicon dicing green parameters

Easily break silicon in cristal plan. Depth of the groove : 25µm

Silicon (525µm) + Si3N4 (150nm up to 1,2µm) OR SiO2 (150nm up to 320nm)

Red (1064nm/255mm)

200 kHz

100%

2,8 W

1000 mm/s

3 bursts

1 (-0,3mm)

350/100

4

50 µm

Silicon nitride cutting parameters

Samples can easily be removed with a soft mechanical pressure. A layer of resist can be deposited on the top without influenced the dicing. Thicker layers (oxyde or nitride) have not been tested.

Nickel (320µm)

Green(532nm/255mm)

200 kHz

100%

0,64 W

300 mm/s

3 burst

none

4320

1

N/A

Cutting Ni 320µm parameters

Cutting through only blue tape left

Pyrex (1000µm)

Red(1064nm/255mm)

200 kHz

100%

2,8 W

1000 mm/s

1 burst

none

99

13

20 µm

Cutting Pyrex 1000µm for microfluidic hole parameters

Increase/decrease the number of iteration to increase/decrease the width of the hole. Microscope view of the chanel

Pyrex/Borosilicate glass (525µm)

Red(1064nm/255mm)

200 kHz

100%

2,96 W

1000 mm/s

1 burst

4 (-0,1/-0,2/-0,3/-0,4mm)

300/500/700/900/1200

4

20 µm

Cutting Pyrex 525µm parameters

Cutting through. Dicing circle.

Steel (50µm)

Green(532nm/255mm)

200 kHz

20%

0,55 W

50 mm/s

1 burst

0

22

Cutting steel 50µm

Cutting shrim for Injection molder.

Steel (100µm)

Green(532nm/255mm)

200 kHz

25%

0,55 W

50 mm/s

1 burst

0

22

Cutting steel 50µm

Cutting shrim for Injection molder.

Steel (200µm)

Green(532nm/255mm)

200 kHz

25%

0,55 W

50 mm/s

1 burst

0

50

Cutting steel 200µm

Cutting shrim for Injection molder.

Aluminum (400µm)

Green(532nm/255mm)

200 kHz

100%

?? W

100 mm/s

3 bursts

0

35-40

4

20

cutting Al 400µm

Cutting shadowmask for Wordentec.

The parameter filename extension is here set to .xls because of MediaWiki restrictions. The 3DMM laser software uses .par as parameter file extension.
The file should be a pure text-file with no formatting codes etc.