Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
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== Performances == | |||
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!style="background:silver; color:black;" align="left"|Purpose | |||
|style="background:LightGrey; color:black"|Patterning, milling and dicing substrates | |||
|style="background:WhiteSmoke; color:black"|Mainly for patterning, milling or dicing substrate with micrometric shapes and above (> 10µm) | |||
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!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Performance | |||
|style="background:LightGrey; color:black"|Resolution | |||
|style="background:WhiteSmoke; color:black"| | |||
Down to 10µm with the blue laser (355nm). Depending on the depth wished. | |||
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|style="background:LightGrey; color:black"|Maximum writing area | |||
|style="background:WhiteSmoke; color:black"| | |||
Depends of the optics. Max size : | |||
* Blue (145x145mm) | |||
* Green ( 165x165mm) | |||
* Red (165x165mm) | |||
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|style="background:LightGrey; color:black"|Output power @100%(laser TB width – picosecond) | |||
|style="background:WhiteSmoke; color:black"| | |||
*100kV | |||
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|style="background:LightGrey; color:black"|Scanning speed | |||
|style="background:WhiteSmoke; color:black"| | |||
*100MHz | |||
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|style="background:LightGrey; color:black"|Min. electron beam size | |||
|style="background:WhiteSmoke; color:black"| | |||
*5nm | |||
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|style="background:LightGrey; color:black"|Min. step size | |||
|style="background:WhiteSmoke; color:black"| | |||
*1nm | |||
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|style="background:LightGrey; color:black"|Beam current range | |||
|style="background:WhiteSmoke; color:black"| | |||
*0.1nA to 60nA in normal conditions (see available condition files <span class="plainlinks">[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=log&mach=292&type=status here]</span>) | |||
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|style="background:LightGrey; color:black"|Dose range | |||
|style="background:WhiteSmoke; color:black"| | |||
*0.001µC/cm<sup>2</sup> to 100000µC/cm<sup>2</sup> | |||
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!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Samples | |||
|style="background:LightGrey; color:black"|Batch size | |||
|style="background:WhiteSmoke; color:black"| | |||
Wafer cassettes: | |||
*6 x 2" wafers | |||
*2 x 4" wafers | |||
*1 x 6" wafer | |||
*Special wafer cassette with slit openings of 20 mm (position A), 12 mm (position B), 8 mm (position C) and 4 mm (position D). | |||
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| style="background:LightGrey; color:black"|Substrate material allowed | |||
|style="background:WhiteSmoke; color:black"| | |||
*Silicon, quartz, pyrex, III-V materials | |||
*Wafers with layers of silicon oxide or silicon (oxy)nitride | |||
*Wafers with layers of metal | |||
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== Process information [[Image:section under construction.jpg|70px]] == | == Process information [[Image:section under construction.jpg|70px]] == | ||