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Specific Process Knowledge/Lithography/Development: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
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{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Spin Track
|style="background:WhiteSmoke; color:black" align="center"|<b>1</b>
|style="background:WhiteSmoke; color:black" align="center"|<b>2</b>
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*HMDS priming
Development of
*Spin coating and soft baking
*AZ nLOF
*Priming, coating, and baking
*AZ MiR 701
|style="background:WhiteSmoke; color:black"|
*AZ 5214E
*HMDS priming
*AZ 4562
*Spin coating and soft baking
*Priming, coating, and baking
*Post-exposure baking
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
!style="background:silver; color:black;" align="center" width="60"|Developer
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
AZ MiR 701 (29cps)
AZ 726 MIF (2.38% TMAH in water)
 
|-
positive tone
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
AZ nLOF 2020
Puddle
 
negative tone
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Coating thickness
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
1 - 3 µm
Room temperature
|style="background:WhiteSmoke; color:black" align="center"|
1 - 4 µm
|-
|-
|style="background:LightGrey; color:black"|HMDS contact angle
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
60° - 90°; standard recipe 82° (on SiO2)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
10 - 9990 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1000 - 50000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
90°C
none
|style="background:WhiteSmoke; color:black" align="center"|
110°C
|-
|style="background:LightGrey; color:black"|HMDS priming temperature
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
50°C
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" align="center"|
100 mm wafers
* 100 mm wafers
* 150 mm wafers
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" align="center"|
Silicon and glass wafers
All Silicon, glass and polymer substrates
 
Film or pattern of all types
|-
|-
|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" align="center"|
1 - 25
1  
|-  
|-  
|}
|}
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