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Specific Process Knowledge/Lithography/Development: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
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*Spin coating SU8 resists
*Spin coating SU8 resists
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!style="background:silver; color:black;" align="center" width="60"|Resist
!style="background:silver; color:black;" align="center" width="60"|Developer chemistry
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
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* SU8 resists manual dispense
* SU8 resists manual dispense
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!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
|style="background:LightGrey; color:black"|Coating thickness
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
* AZ5214E 1-4,2 µm
* AZ5214E 1-4,2 µm
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* SU8 resits 0,1-100 µm
* SU8 resits 0,1-100 µm
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" align="center"|
100 - 5000 rpm
100 - 5000 rpm
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|style="background:LightGrey; color:black"|Spin acceleration
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" align="center"|
100 - 5000 rpm/s
100 - 5000 rpm/s
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|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
* changeable temperature from 20° to 200°
* SU8 must be bake out on SU8 dedicated hotplates
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" align="center"|
* 50 mm wafers
* 50 mm wafers
* 100 mm wafers
* 100 mm wafers
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" align="center"|
All cleanroom materials except III-V materials
All cleanroom materials except III-V materials
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|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" align="center"|
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