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Specific Process Knowledge/Lithography/Development: Difference between revisions

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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,526 edits
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===Process information===
===Process information===
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing|General Spin Track 1 + 2 process information]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing|General Spin Track 1 + 2 process information]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#HMDS priming only|HMDS priming on Spin Track 1 and 2]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#AZ MiR 701 (29cps) coating|AZ MiR 701 (29cps) coating on Spin Track 1]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#AZ nLOF 2020 coating|AZ nLOF 2020 coating on Spin Track 2]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#Post-exposure baking (PEB)|Post-exposure baking on Spin Track 2]]


=== Equipment performance and process related parameters ===
=== Equipment performance and process related parameters ===
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