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Specific Process Knowledge/Lithography/Development: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,526 edits
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|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]</b>
|-
|-
!style="background:silver; width:100px; color:black;" align="center"|Purpose  
!style="background:silver; width:100px; color:black;" align="center"|Purpose  
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
* Cassette-to-cassette
|-
|-
|style="background:LightGrey; color:black"|Permanent media
|style="background:LightGrey; color:black"|Permanent media
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* PGMEA for backside rinse and edge-bead removal
* PGMEA for backside rinse and edge-bead removal
* PGMEA for spinner bowl cleaning and vapor tip bath
* PGMEA for spinner bowl cleaning and vapor tip bath
|-
|-
|style="background:LightGrey; color:black"|Manual dispense option
|style="background:LightGrey; color:black"|Manual dispense option
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* no
* no
|style="background:WhiteSmoke; color:black"|
* Two syringe pumps


|-
|-
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*10 - 9990 rpm
*10 - 9990 rpm
|style="background:WhiteSmoke; color:black"|
*100-5000 rpm
|style="background:WhiteSmoke; color:black"|
*10-5000 rpm
|style="background:WhiteSmoke; color:black"|
|-
|-
|style="background:LightGrey; color:black"|Gyrset
|style="background:LightGrey; color:black"|Gyrset
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*no
*no
|style="background:WhiteSmoke; color:black"|
 
*no
|style="background:WhiteSmoke; color:black"|
*no
|style="background:WhiteSmoke; color:black"|
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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*100 mm wafers
*100 mm wafers
*150 mm wafers (tool change required)
*150 mm wafers (tool change required)
|style="background:WhiteSmoke; color:black"|
*50 mm wafers
*100 mm wafers
*150 mm wafer
*small pieces down to 10x10 mm2
|style="background:WhiteSmoke; color:black"|
*50 mm wafers
*100 mm wafers
*150 mm wafer
*small pieces down to 3x3 mm2
|style="background:WhiteSmoke; color:black"|
*Any sample(s) that fit inside machine
|-
|-
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1-25
*1-25
|style="background:WhiteSmoke; color:black"|
*1
|style="background:WhiteSmoke; color:black"|
*1
|style="background:WhiteSmoke; color:black"|
*1
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
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*Silicon  
*Silicon  
*Glass
*Glass
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except III-V materials
|style="background:WhiteSmoke; color:black"|
*III-V materials
*Si, SiO2, SOI
|style="background:WhiteSmoke; color:black"|
*All chemicals to be spray coated must be approved specifically for spray coating
*Any non-toxic, non-particulate and non-crosslinking material is likely to be approved
|-  
|-  
|}
|}
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