Specific Process Knowledge/Lithography/LiftOff

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Lift-off process

Schematic of the lift-off process.

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Comparing Lift-off equipment

Equipment		Lift-off Wet Bench	Lift-off (4", 6")
Purpose		AZ 5214E lift-off	AZ 5214E lift-off AZ nLOF lift-off
Bath chemical		Acetone	NMP (Remover 1165)
Process parameters	Process temperature	Room temperature	Heating of the bath is possible. The heating has been limited to 37°C
	Ultrasonic agitation	Continuous (on/off)	Continuous or pulsed The power may be varied
Substrates	Substrate size	100 mm wafers	100 mm wafers 150 mm wafers
	Allowed materials	Silicon or glass wafers Film or patterning of all but Type IV (Pb, Te)	Silicon or glass wafers Film or patterning of all but Type IV (Pb, Te)
	Batch	1 - 25	1 - 8

Lift-off Wet Bench

Lift-off wet bench in D-3

This bench is only for wafers with metal!

The user manual, and contact information can be found in LabManager

Process information

Process recommandations for Lift-off wet bench:

• Place the wafers in a dedicated wafer holder.
• Put the holder in the acetone and start the ultrasound. The strip off time is depending of resist thickness.
• Rinse your wafers for 4-5 min. in running water after stripping.

For more information on image reversal of AZ 5214E, see here: Specific Process Knowledge/Photolithography/AZ5214E standard resist - reverse process

Lift-off (4", 6")

Lift-off (4", 6") in D-3

The user manual, and contact information can be found in LabManager

Process information

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