Specific Process Knowledge/Lithography/LiftOff: Difference between revisions

From LabAdviser
Taran (talk | contribs)
Taran (talk | contribs)
Line 83: Line 83:


=Lift-off (4", 6")=
=Lift-off (4", 6")=
[[Image:Acetone_lift-off.jpg|300x300px|thumb|Lift-off wet bench in D-3]]


'''The user manual, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=71 LabManager]'''
'''The user manual, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=71 LabManager]'''

Revision as of 15:45, 5 March 2014

Feedback to this page: click here

Comparing Lift-off equipment

Equipment Lift-off Wet Bench Lift-off (4", 6")
Purpose
  • AZ 5214E lift-off
  • AZ 5214E lift-off
  • AZ nLOF lift-off
Bath chemical

Acetone

NMP (Remover 1165)

Process parameters Process temperature

Room temperature

Heating of the bath is possible.

The heating has been limited to 37°C

Ultrasonic agitation

Continuous

Continuous or pulsed

Substrates Substrate size
  • 100 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials

All cleanroom materials

All cleanroom materials

Batch

1 - 25

1 - 8


Lift-off Wet Bench

Lift-off wet bench in D-3

This bench is only for wafers with metal!

The user manual, and contact information can be found in LabManager


Process information

Here are the main rules for lift-off bench use:

  • Place the wafers in a dedicated wafer holder.
  • Put the holder in the acetone and start the ultrasound. The strip off time is depending of resist thickness.
  • Rinse your wafers for 4-5 min. in running water after stripping.

Find more info about the lift-off process here: Specific Process Knowledge/Photolithography/AZ5214E standard resist - reverse process

Lift-off (4", 6")

Lift-off wet bench in D-3

The user manual, and contact information can be found in LabManager


Process information

bla bla bla