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Specific Process Knowledge/Lithography/LiftOff: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,794 edits
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NMP (Remover 1165)
NMP (Remover 1165)
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!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Contact angle
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standard recipe 82° (on SiO<sub>2</sub>)
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60° - 90°; standard recipe 82° (on SiO<sub>2</sub>)
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
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|style="background:LightGrey; color:black"|Ultrasonic agitation
|style="background:LightGrey; color:black"|Ultrasonic agitation
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Yes
Continous
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|style="background:WhiteSmoke; color:black" align="center"|
Yes
Continous or pulsed
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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