Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching'' | *[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching'' | ||
*[[/Hummer|Hummer]] - ''Gold sputtering system'' | *[[/Hummer|Hummer]] - ''Gold sputtering system'' | ||
*[[/ | *[[/Sputter coater|Sputter coater]] - ''Gold sputtering system'' | ||
|style="background: #DCDCDC"| | |style="background: #DCDCDC"| | ||
*[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Silicon_Nitride/Deposition_of_Silicon_Nitride_using_LPCVD|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride'' | *[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Silicon_Nitride/Deposition_of_Silicon_Nitride_using_LPCVD|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride'' | ||