Specific Process Knowledge/Thin film deposition

3rd Level - Material/Methode

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Choose material to deposit

Dielectrica	Semicondutors	Metals	Alloys	Polymers
Silicon Nitride - and oxynitride Silicon Oxide Titanium Oxide	Silicon Germanium	Aluminium Titanium Chromium Nickel Copper Molybdenum Palladium Silver Tin Tantalum Tungsten Platinum Gold	TiW alloy (10%/90% by weight) NiCr alloy AlTi alloy NiV alloy	SU8 Antistiction coating Topas PMMA

Choose deposition equipment

PVD	LPCVD	PECVD	Coaters	Others
Alcatel - E-beam evaporator and sputter tool Lesker - Sputter tool PVD co-sputter/evaporation - E-beam evaporator and multiple wafer tool Wordentec - E-beam evaporator, sputter and thermal evaporator Physimeca - E-beam evaporator (III-V lab) IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching Hummer - Gold sputtering system	Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride Furnace LPCVD Polysilicon (4" and 6") - Deposition of polysilicon Furnace LPCVD TEOS (4") - Deposition of silicon oxide	PECVD - Plasma Enhanced Chemical Vapor deposition Black Magic PECVD - Black Magic PECVD (Carbon)	See the Lithography/Coaters page for coating polymers	MVD - Molecular Vapor Deposition Electroplating-Ni - Electrochemical deposition of nickel