Specific Process Knowledge/Thin film deposition/PECVD: Difference between revisions
| Line 107: | Line 107: | ||
|style="background:LightGrey; color:black"|Batch size | |style="background:LightGrey; color:black"|Batch size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *One 4" wafer per run | ||
*One 6" wafer per run | |||
*Or several smaler pieces on carrier wafer | |||
*Deposition on one side of the substrate | |||
| | | | ||
*1-3 4" wafer per run | *1-3 4" wafer per run | ||