Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions
No edit summary |
|||
Line 34: | Line 34: | ||
Purpose | Purpose | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
Thickness measurer | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Wafer | |||
*Depths of larger grooves | |||
*Heigth of larger mesas | |||
|- | |- | ||
!style="background:silver; color:black" align="center"| | !style="background:silver; color:black" align="center"| | ||
Performance | Performance | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
Thickness within | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
0.5 µm | |||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan=" | !style="background:silver; color:black" align="center" valign="center" rowspan="2"| | ||
Process parameter range | Process parameter range | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
Process Temperature | Process Temperature | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *Room temperature | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Process pressure | |style="background:LightGrey; color:black"|Process pressure | ||
Line 56: | Line 58: | ||
*1 atm | *1 atm | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"| | |||
Substrates | |||
|style="background:LightGrey; color:black"| | |||
Batch size | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates | |||
|style="background:LightGrey; color:black"|Batch size | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *One sample per measure | ||
|- | |- | ||
| style="background:LightGrey; color:black"|Substrate materials allowed | | style="background:LightGrey; color:black"|Substrate materials allowed | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
No restriction. | |||
|- | |- | ||
|} | |} |
Revision as of 11:20, 13 January 2014
THIS PAGE IS UNDER CONSTRUCTION
Feedback to this page: click here
Thickness measurer
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
Doing a KOH etch can it be helpful to insure no over etching by making a thickness measurement doing the etch.
The user manual, technical information and contact information can be found in LabManager:
Quality Control - Recipe Parameters and Limits
Quality Control (QC) for the Thickness measurer |
The measured standard thickness is 0.1 mm. The measured result have to be within +- 0.005 mm. The QC is preformed ones a year. |
Purpose |
Thickness measurer |
|
---|---|---|
Performance |
Thickness within |
0.5 µm |
Process parameter range |
Process Temperature |
|
Process pressure |
| |
Substrates |
Batch size |
|
Substrate materials allowed |
No restriction. |
Feedback to this page: click here
This is a micrometer-screw.
It measures with an accurracy within a few µm. The range is from a few µm up to 5mm. Measure the wafer in the box next to the meter. If this is ok, then other wafers can be measured. There is a calibration device by the DEKTAK. It is calibrated at 750µm.