Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions

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	The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.		The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.

	Doing a KOH etch can it be helpful to insure no over etching by making a thickness measurement doing the etch.		Doing a KOH etch can it be helpful to insure no over etching by making a thickness measurement doing the etch.