Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions

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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Thickness_Measurer click here]'''
==Thickness measurer==
[[Image:??.jpg|thumb|300x300px|Thickness meassurer. Positioned in cleanroom 4]]
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
Doing a KOH etch can it be helpful to insure no over etching by making a thickness measurement doing the etch.
'''The user manual, technical information and contact information can be found in LabManager:'''
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]'''
==Process knowledge==
==Equipment performance and process related parameters==
{| border="2" cellspacing="2" cellpadding="0"
|-
!style="background:silver; color:black;" align="center"|
Purpose
|style="background:LightGrey; color:black"|
Measurer the thinkness of silicon wafer
|style="background:WhiteSmoke; color:black"|
??
|-
!style="background:silver; color:black" align="center"|
Performance
|style="background:LightGrey; color:black"|
??
|style="background:WhiteSmoke; color:black"|
??
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|
Process parameter range
|style="background:LightGrey; color:black"|
Process Temperature
|style="background:WhiteSmoke; color:black"|
*800-1150 <sup>o</sup>C
|-
|style="background:LightGrey; color:black"|Process pressure
|style="background:WhiteSmoke; color:black"|
*1 atm
|-
|style="background:LightGrey; color:black"|Gasses on the system
|style="background:WhiteSmoke; color:black"|
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*1-30 100 mm wafers (or 50 mm wafers) per run
|-
| style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:WhiteSmoke; color:black"|
*Silicon wafers (RCA cleaned) without metal bulk contamination
|-
|}
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Thickness_Measurer click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Thickness_Measurer click here]'''  


Revision as of 10:13, 13 January 2014

THIS PAGE IS UNDER CONSTRUCTION

Feedback to this page: click here

Thickness measurer

File:??.jpg
Thickness meassurer. Positioned in cleanroom 4

The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. Doing a KOH etch can it be helpful to insure no over etching by making a thickness measurement doing the etch.

The user manual, technical information and contact information can be found in LabManager:

Thickness measurer

Process knowledge

Equipment performance and process related parameters

Purpose

Measurer the thinkness of silicon wafer

??

Performance

??

??

Process parameter range

Process Temperature

  • 800-1150 oC
Process pressure
  • 1 atm
Gasses on the system
Substrates Batch size
  • 1-30 100 mm wafers (or 50 mm wafers) per run
Substrate materials allowed
  • Silicon wafers (RCA cleaned) without metal bulk contamination


Feedback to this page: click here


This is a micrometer-screw.

The Thickness measurer in Cleanroom 3

It measures with an accurracy within a few µm. The range is from a few µm up to 5mm. Measure the wafer in the box next to the meter. If this is ok, then other wafers can be measured. There is a calibration device by the DEKTAK. It is calibrated at 750µm.

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