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Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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Chasil (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
547 edits
Line 188: Line 188:
| 4
| 4
| 20 µm
| 20 µm
| [[media:Cutting_Pyrex_1064nm_255mm.xls|Cutting Pyrex 525µm parameters]]
| [[media:TB_1064nm_255mm_cutting_Pyrex_525um.xls|Cutting Pyrex 525µm parameters]]
| Cutting through. Dicing circle.  
| Cutting through. Dicing circle.  
|-
|-
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