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Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions

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| 50 µm
| 50 µm
| [[media:Dicing_Si_Si3N4_1064nm_f255mm.xls|Silicon nitride cutting parameters]]
| [[media:Dicing_Si_Si3N4_1064nm_f255mm.xls|Silicon nitride cutting parameters]]
| Samples can easily be removed with a soft mecanical pressure. A layer of resist (AZMIR701) can be deposited on the top without influence the dicing. However, the burnt resist may induce cracks that can propagate, under the influence of the number of iteration. The blue tape may sticks to the wafer a the end of the process. 
| Samples can easily be removed with a soft mecanical pressure. A layer of resist (AZMIR701) can be deposited on the top without influence the dicing.  
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|- style="background:LightGray;text-align:center" valign="top"
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