Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
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| Samples can easily be removed with a soft mecanical pressure. A layer of resist (AZMIR701) can be deposited on the top without influence the dicing. | | Samples can easily be removed with a soft mecanical pressure. A layer of resist (AZMIR701) can be deposited on the top without influence the dicing. | ||
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Revision as of 09:34, 13 January 2014
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Laser Micromachining Tool 
The Laser Micromachining Tool is a microSTRUCT vario from the company 3D-Micromac AG.
The machine is located in the basement of building 346 under the cleanroom.
The user manual(s), user APV(s), technical information and contact information can be found in LabManager: [1]
It is equipped with 2 high power lasers:
- a 50W picosecond laser that can emit light at 3 wavelengths: 355nm, 532nm and 1064nm (Time-Bandwidth Products, Fuego/Duetto. See some details in this article: [2] )
- and a
- a 100W nanosecond laser with a wavelength of 1064nm (IPG Laser YLP-HP series).
The system is able to produce micro structures in different kinds of materials like metals, ceramics, composite materials, etc. It can produce features down to ~10µm size over a large area. It can scan over an area of up to ~15x15cm without moving the sample. By moving the sample on the large x-y-stage this area can be extended by stitching.
Process information
- Silicon cutting and milling
- Borofloat glass cutting and milling
- Quartz cutting and milling
- Nickel cutting and milling (for Polymer Injection Molder)
- Mask making
Laser Processing details
| Material | Optics | Frequency | Intensity | Power measured @10% | Writing speed | Number of burst | Number of Z-offset | Number of iteration | Number of parallel lines | Gap in between line | Parameter file | Comments |
| Silicon 525µm | Green(532nm/255mm) | 200 kHz | 100% | 0,57 W | 50 mm/s | 1 burst | none | 4 | 1 | N/A | Silicon dicing green parameters | Easily break silicon in cristal plan. Depth of the groove : 25µm |
| Silicon (525µm) + Si3N4 (150nm to 1,2µm) OR SiO2 (150nm to 320nm) | Red (1064nm/255mm) | 200 kHz | 100% | 2,8 W | 1000 mm/s | 3 bursts | 1 (-0,3mm) | 350/100 | 4 | 50 µm | Silicon nitride cutting parameters | Samples can easily be removed with a soft mecanical pressure. A layer of resist (AZMIR701) can be deposited on the top without influence the dicing. |
| Nickel (320µm) | Green(532nm/255mm) | 200 kHz | 100% | 0,64 W | 300 mm/s | 3 burst | none | 4320 | 1 | N/A | Cutting Ni 320µm parameters | Cutting through only blue tape left |
| Pyrex 1000µm | Red(1064nm/255mm) | 200 kHz | 100% | 2,8 W | 1000 mm/s | 1 burst | none | 99 | 13 | 20 µm | Cutting Pyrex 1000µm for microfluidic hole parameters | Increase/decrease the number of iteration to increase/decrease the width of the hole. 
|
| Pyrex/Borosilicate glass (525µm) | Red(1064nm/255mm) | 200 kHz | 100% | 2,96 W | 1000 mm/s | 1 burst | 4 (-0,1/-0,2/-0,3/-0,4mm) | 300/500/700/900/1200 | 4 | 20 µm | Cutting Pyrex 525µm parameters | Cutting through. Dicing circle. |
The parameter filename extension is here set to .doc because of MediaWiki restrictions. The 3DMM laser software uses .par as parameter file extension. The file should be a pure text-file with no formatting codes etc.