Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
No edit summary |
|||
| Line 8: | Line 8: | ||
The Laser Micromachining Tool is a microSTRUCT vario from the company 3D-Micromac AG. | The Laser Micromachining Tool is a microSTRUCT vario from the company 3D-Micromac AG. | ||
The machine is located in the basement of building 346 under the cleanroom. | The machine is located in the basement of building 346 under the cleanroom. | ||
| Line 15: | Line 13: | ||
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager:''' | '''The user manual(s), user APV(s), technical information and contact information can be found in LabManager:''' | ||
<!-- remember to remove the type of documents that are not present --> | <!-- remember to remove the type of documents that are not present --> | ||
<!-- give the link to the equipment info page in LabManager: --> | <!-- give the link to the equipment info page in LabManager: --> | ||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=309 | [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=309] | ||
It is equipped with 2 high power lasers: | It is equipped with 2 high power lasers: | ||
* a 50W picosecond laser that can emit light at 3 wavelengths: 355nm, 532nm and 1064nm and a | * a 50W picosecond laser that can emit light at 3 wavelengths: 355nm, 532nm and 1064nm (Time-Bandwidth Products, Fuego/Duetto. See some details in this article: [http://www.time-bandwidth.com/upload/press/weingartenlasertechnikjournalvol6issue3p51.pdf)] ) | ||
* a 100W nanosecond laser with a wavelength of 1064nm. | *: and a | ||
* a 100W nanosecond laser with a wavelength of 1064nm (IPG Laser YLP-HP series). | |||
It | The system is able to produce micro structures in different kinds of materials like metals, ceramics, composite materials, etc. | ||
It can produce features down to ~10µm size over a large area. It can scan over an area of up to ~15x15cm without moving the sample. By moving the sample on the large x-y-stage this area can be extended by stitching. | |||
== Process information [[Image:section under construction.jpg|70px]] == | == Process information [[Image:section under construction.jpg|70px]] == | ||
| Line 42: | Line 35: | ||
=== Laser Processing details === | === Laser Processing details === | ||
<!-- | |||
{| {{table}} | {| {{table}} | ||
| align="center" valign="top" style="background:LightGray"|''' Material''' | | align="center" valign="top" style="background:LightGray"|''' Material''' | ||
| Line 107: | Line 101: | ||
|- | |- | ||
|} | |} | ||
--> | |||
{| {{table}} | {| {{table}} | ||