Specific Process Knowledge/Lithography/UVExposure: Difference between revisions
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'''The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager:''' | '''The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager:''' | ||
Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=201 LabManager] | Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=201 LabManager] | ||
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=== Equipment performance and process related parameters === | |||
{| border="2" cellspacing="0" cellpadding="2" | |||
!style="background:silver; color:black;" align="center" width="60"|Purpose | |||
|style="background:LightGrey; color:black"| | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
Alignment and UV exposure | |||
|- | |||
!style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance | |||
|style="background:LightGrey; color:black"|Exposure mode | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
*soft contact, hard contact, proximity, flood exposure | |||
*automatic loading optional for 6inch substrates | |||
*automatic pattern recognition optional for special alignment marks | |||
|- | |||
| style="background:LightGrey; color:black"|Exposure light/filters | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
*365 nm, light intensity 7,0 mW&cm2 in Constant Intansity (CI2)mode | |||
*303 nm filters optinal | |||
|- | |||
|style="background:LightGrey; color:black"|Minimum structure size | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
* down to 1um exposure with 4inch chuck | |||
* down to 5um exposure with 6inch chuck | |||
|- | |||
|style="background:LightGrey; color:black"|Mask size | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
*5x5inch | |||
*7x7inch | |||
|- | |||
|style="background:LightGrey; color:black"|Alignment modes | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
*Top Side Alignment(TSA) | |||
*Bottom Side Alignment(BSA) | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
* 50 mm wafers | |||
* 110 mm wafers | |||
* 150 mm wafers | |||
|- | |||
| style="background:LightGrey; color:black"|Allowed materials | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
All cleanroom materials except III-V materials | |||
|- | |||
|style="background:LightGrey; color:black"|Batch | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
*1 for 4inch substrates | |||
*25 for 6inch substrates in automatic loading mode | |||
|- | |||
|} | |||
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