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Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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=== Equipment performance and process related parameters ===
{| border="2" cellspacing="0" cellpadding="2"
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*alignment and UV exposure
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!style="background:silver; color:black" align="left" valign="top" rowspan="6"|Performance
|style="background:LightGrey; color:black"|substrate size
|style="background:WhiteSmoke; color:black"|
small pieces 1x1 cm up to 2inch"
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|style="background:LightGrey; color:black"|Exposure mode
|style="background:WhiteSmoke; color:black"|
soft contact, hard contact, proximity, flood exposure
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| style="background:LightGrey; color:black"|Exposure light/filters
|style="background:WhiteSmoke; color:black"|
365 nm, 405 nm
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|style="background:LightGrey; color:black"|Minimum structure size
|style="background:WhiteSmoke; color:black"|
~1µm
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|style="background:LightGrey; color:black"|Mask size
|style="background:WhiteSmoke; color:black"|
5x5inch
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|style="background:LightGrey; color:black"|Alignment modes
|style="background:WhiteSmoke; color:black"|
Top side only
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
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| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
All cleanroom materials except III-V materials
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|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1 - 24
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