Specific Process Knowledge/Lithography/UVExposure: Difference between revisions
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== KS Aligner == | == KS Aligner == | ||
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#KS_Aligner click here]''' | |||
[[Image:KSaligner.jpg|300x300px|thumb|The KSaligner MA6 is placed in Cleanroom 3.]] | [[Image:KSaligner.jpg|300x300px|thumb|The KSaligner MA6 is placed in Cleanroom 3.]] | ||
SUSS Mask Aligner MA6 is designed for high resolution photolithography. | SUSS Mask Aligner MA6 is designed for high resolution photolithography. | ||
The 365nm exposure wavelength version is capable of 1.25 (1.0) um resolution in vacuum contact. All contact exposure programs (vacuum, hard, soft, proximity) are supplied. | The 365nm exposure wavelength version is capable of 1.25 (1.0) um resolution in vacuum contact. All contact exposure programs (vacuum, hard, soft, proximity) are supplied. | ||