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Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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*1.25µm  
*1.25µm  
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!
*2µm
 
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|style="background:LightGrey; color:black"|Exposure light/filters/spectrum
|style="background:LightGrey; color:black"|Exposure light/filters/spectrum
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*  
*350W Hg-lamp
*the hole spectrum of 350W hg-lamp
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*1000 W Hg(Xe)lamp source
*1000 W Hg(Xe)lamp source
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*proximity, soft, hard, vacuum contact  
*proximity, soft, hard, vacuum contact  
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*proximity, soft, hard, vacuum contact  
*proximity, soft, hard, vacuum contact  
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!
*Flood exposure
 
*Proximity exposure with home-made chuck and maskholder


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|style="background:LightGrey; color:black"|Positive Process
|style="background:LightGrey; color:black"|Positive Process
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*
*dose 42mW/cm2 for 1,5um AZ5214E resist
*dose 56mW/cm2 for 2,2um AZ5214E resist
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*
*dose 23mW/cm2 for 1,5um AZ5214E resist
*dose 35mW/cm2 for 2,2um AZ5214E resist
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*
*
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*
*polymer depended


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|style="background:LightGrey; color:black"|Negative Process
|style="background:LightGrey; color:black"|Negative Process
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*
*dose 21mW/cm2 for 1,5um AZ5214E resist
*dose 28mW/cm2 for 2,2um AZ5214E resist
then 210mW/cm2 flood exposure after PEB
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*
*dose 16mW/cm2 for 1,5um AZ5214E resist
*dose 18mW/cm2 for 2,2um AZ5214E resist
then 210mW/cm2 flood exposure after PEB
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*
*
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*
*polymer depended


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*<nowiki>1</nowiki> 150 mm wafers
*<nowiki>1</nowiki> 150 mm wafers
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*
*all sizes up to 8inch
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
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*Si and silicon oxide, silicon nitride
*All cleanroom materials
*Quartz, pyrex
*Dedicated 2inch chuck for III-V materials
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*Si and silicon oxide, silicon nitride
*All cleanroom materials except III-V materials
*Quartz, pyrex
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*III-V compounds
*III-V compounds
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*
*All cleanroom materials
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