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Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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|style="background:LightGrey; color:black"|Exposure light/filters/spectrum
|style="background:LightGrey; color:black"|Exposure light/filters/spectrum
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*  
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Spindle speed
|style="background:LightGrey; color:black"|Positive Process
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*Range
*
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*Range
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*10 - 9990 rpm
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*10-5000 rpm
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|style="background:LightGrey; color:black"|Parameter 2
|style="background:LightGrey; color:black"|Negative Process
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*Range
*
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*Range
*
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*Range
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|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
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*<nowiki>24</nowiki> 50 mm wafers
*<nowiki>1</nowiki> small samples
*<nowiki>24</nowiki> 100 mm wafers
*<nowiki>1</nowiki> 50 mm wafers
*<nowiki>24</nowiki> 150 mm wafers
*<nowiki>1</nowiki> 100 mm wafers
*<nowiki>1</nowiki> 150 mm wafers
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*<nowiki>1</nowiki> 100 mm wafer
*<nowiki>1</nowiki> 50 mm wafers
*<nowiki>1</nowiki> 150 mm wafer
*<nowiki>1</nowiki> 100 mm wafers
*<nowiki>25</nowiki> 150 mm wafers with automatic handling
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|style="background:WhiteSmoke; color:black"|
*<nowiki>25</nowiki> 100 mm wafers
*<nowiki>1</nowiki> small samples
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*<nowiki>1</nowiki> 50 mm wafers
 
*<nowiki>1</nowiki> 100 mm wafers
* Maximum substrate size: 6"
*<nowiki>1</nowiki> 150 mm wafers
* Minimum substrate size: 3*3 mm2
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* maximum substrate thickness: 4 mm
*
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
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*Allowed material 1
*Si and silicon oxide, silicon nitride
*Allowed material 2
*Quartz, pyrex
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*Si and silicon oxide, silicon nitride
*Quartz, pyrex
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*Allowed material 1
*III-V compounds
*Allowed material 2
*Allowed material 3
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*Silicon
*
*Glass
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*III-V compound semiconductors
*Si, SiO2, SOI
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