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Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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DCH-Employees-701
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|style="background:LightGrey; color:black"|  
|style="background:LightGrey; color:black"|  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spinning and baking of AZ5214E resist
*TS and BS Alignment
*Spinning and baking of AZ4562 resist
*UV exposure
*Spinning and baking of e-beam resist
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spinning and baking of AZ5214E resist
*TS and BS Alignment
*Spinning and baking of AZ4562 resist
*UV exposure
*Spinning and baking of SU8 resist
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*In-line substrate HMDS priming
*TS Alignment
*Coating and baking of AZ MiR 701 (29cps) resist
*UV exposure  
*Coating and baking of AZ nLOF 2020 resist
*Post-exposure baking at 110°C
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
|style="background:LightGrey; color:black"|Substrate handling
|style="background:LightGrey; color:black"|Minimum feature size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
*1.25µm down to 1.0µm
* Edge handling chuck
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Single substrate
*1.25µm
* Non-vacuum chuck for fragile substrates
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
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|Single substrate
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|style="background:LightGrey; color:black"|Permanent media
|style="background:LightGrey; color:black"|Exposure light/filters/spectrum
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* AZ5214E resist
* 350W Hg-lamp, 365nm filter, 303nm filter optional
* AZ4562 resist
* intensity in Constant Intensity(CI) mode 7mJ/cm2
* Acetone for chuck cleaning
* Acetone for drip pan
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* AZ5214E resist
* 350W Hg-lamp, SU8 filter, 365nm filter optional
* PGMEA for edge bead removal
* intensity in Constant Intensity(CI) mode 7mJ/cm2
* Acetone for chuck cleaning
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps) resist
*  
* AZ nLOF 2020 resist
* PGMEA for backside rinse and edge-bead removal
* PGMEA for spinner bowl cleaning and vapor tip bath
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|style="background:LightGrey; color:black"|Manual dispense option
|style="background:LightGrey; color:black"|Exposure mode
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* 2 automatic syringes
*proximity, soft, hard, vacuum contact
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* yes
*proximity, soft, hard, vacuum contact
* pneumatic dispense for SU8 resist
*proximity, soft, hard, vacuum contact
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* no
*  


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