Specific Process Knowledge/Lithography/UVExposure: Difference between revisions
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== EVG Aligner == | == EVG Aligner == | ||
[[Image:EVG620.jpg|300x300px|thumb|Aligner-6inch EVG620 is placed in Cleanroom 13.]] | |||
EVG620 aligner is designed for high resolution photolithography. | |||
The machine can be used for 2, 4 and 6 inch substrates. Cassette-to-cassette handling option is available only for 6inch substrates. | |||
The automatic pattern recognition software is available for the special alignment marks design recommended of EVGroup. Please contact Danchip staff for further information. | |||
Available exposure mode: proximity, soft, hard and vacuum contact. | |||
Two alignment options are available: top side alignment (TSA) and back side alignment (BSA). IR-light alignment also an option. | |||
'''The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager:''' | |||
Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=201 LabManager] | |||
== III-V Aligner == | == III-V Aligner == | ||