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== UV Exposure Comparison Table ==
{| border="2" cellspacing="0" cellpadding="2"
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#EVG Aligner|EVG Aligner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#III-V Aligner|III-V Aligner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Inclined UV Lamp|Inclined UV Lamp]]</b>
|-
!style="background:silver; width:100px; color:black;" align="center"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spinning and baking of AZ5214E resist
*Spinning and baking of AZ4562 resist
*Spinning and baking of e-beam resist
|style="background:WhiteSmoke; color:black"|
*Spinning and baking of AZ5214E resist
*Spinning and baking of AZ4562 resist
*Spinning and baking of SU8 resist
|style="background:WhiteSmoke; color:black"|
*In-line substrate HMDS priming
*Coating and baking of AZ MiR 701 (29cps) resist
*Coating and baking of AZ nLOF 2020 resist
*Post-exposure baking at 110°C
|
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
|style="background:LightGrey; color:black"|Substrate handling
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
* Edge handling chuck
|style="background:WhiteSmoke; color:black"|
* Single substrate
* Non-vacuum chuck for fragile substrates
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
|Single substrate
|-
|style="background:LightGrey; color:black"|Permanent media
|style="background:WhiteSmoke; color:black"|
* AZ5214E resist
* AZ4562 resist
* Acetone for chuck cleaning
* Acetone for drip pan
|style="background:WhiteSmoke; color:black"|
* AZ5214E resist
* PGMEA for edge bead removal
* Acetone for chuck cleaning
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps) resist
* AZ nLOF 2020 resist
* PGMEA for backside rinse and edge-bead removal
* PGMEA for spinner bowl cleaning and vapor tip bath
|
|-
|style="background:LightGrey; color:black"|Manual dispense option
|style="background:WhiteSmoke; color:black"|
* 2 automatic syringes
|style="background:WhiteSmoke; color:black"|
* yes
* pneumatic dispense for SU8 resist
|style="background:WhiteSmoke; color:black"|
* no
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Spindle speed
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*10 - 9990 rpm
|
*10-5000 rpm
|-
|style="background:LightGrey; color:black"|Parameter 2
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*<nowiki>24</nowiki> 50 mm wafers
*<nowiki>24</nowiki> 100 mm wafers
*<nowiki>24</nowiki> 150 mm wafers
|style="background:WhiteSmoke; color:black"|
*<nowiki>1</nowiki> 100 mm wafer
*<nowiki>1</nowiki> 150 mm wafer
|style="background:WhiteSmoke; color:black"|
*<nowiki>25</nowiki> 100 mm wafers
|
* Maximum substrate size: 6"
* Minimum substrate size: 3*3 mm2
* maximum substrate thickness: 4 mm
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*Allowed material 2
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*Allowed material 2
*Allowed material 3
|style="background:WhiteSmoke; color:black"|
*Silicon
*Glass
|
*III-V compound semiconductors
*Si, SiO2, SOI
|-
|}
<br clear="all" />
== KS Aligner ==
== EVG Aligner ==
== III-V Aligner ==
==Inclined UV lamp==
==Inclined UV lamp==
[[Image:Inclined UV lamp_1.jpg|200×200px|right|thumb|Inclined UV lamp is placed in Cleanroom 13.]]
[[Image:Inclined UV lamp_1.jpg|200×200px|right|thumb|Inclined UV lamp is placed in Cleanroom 13.]]
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