Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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== UV Exposure Comparison Table ==
{| border="2" cellspacing="0" cellpadding="2"
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#EVG Aligner|EVG Aligner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#III-V Aligner|III-V Aligner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Inclined UV Lamp|Inclined UV Lamp]]</b>
|-
!style="background:silver; width:100px; color:black;" align="center"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spinning and baking of AZ5214E resist
*Spinning and baking of AZ4562 resist
*Spinning and baking of e-beam resist
|style="background:WhiteSmoke; color:black"|
*Spinning and baking of AZ5214E resist
*Spinning and baking of AZ4562 resist
*Spinning and baking of SU8 resist
|style="background:WhiteSmoke; color:black"|
*In-line substrate HMDS priming
*Coating and baking of AZ MiR 701 (29cps) resist
*Coating and baking of AZ nLOF 2020 resist
*Post-exposure baking at 110°C
|
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
|style="background:LightGrey; color:black"|Substrate handling
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
* Edge handling chuck
|style="background:WhiteSmoke; color:black"|
* Single substrate
* Non-vacuum chuck for fragile substrates
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
|Single substrate
|-
|style="background:LightGrey; color:black"|Permanent media
|style="background:WhiteSmoke; color:black"|
* AZ5214E resist
* AZ4562 resist
* Acetone for chuck cleaning
* Acetone for drip pan
|style="background:WhiteSmoke; color:black"|
* AZ5214E resist
* PGMEA for edge bead removal
* Acetone for chuck cleaning
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps) resist
* AZ nLOF 2020 resist
* PGMEA for backside rinse and edge-bead removal
* PGMEA for spinner bowl cleaning and vapor tip bath
|
|-
|style="background:LightGrey; color:black"|Manual dispense option
|style="background:WhiteSmoke; color:black"|
* 2 automatic syringes
|style="background:WhiteSmoke; color:black"|
* yes
* pneumatic dispense for SU8 resist
|style="background:WhiteSmoke; color:black"|
* no
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Spindle speed
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*10 - 9990 rpm
|
*10-5000 rpm
|-
|style="background:LightGrey; color:black"|Parameter 2
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*<nowiki>24</nowiki> 50 mm wafers
*<nowiki>24</nowiki> 100 mm wafers
*<nowiki>24</nowiki> 150 mm wafers
|style="background:WhiteSmoke; color:black"|
*<nowiki>1</nowiki> 100 mm wafer
*<nowiki>1</nowiki> 150 mm wafer
|style="background:WhiteSmoke; color:black"|
*<nowiki>25</nowiki> 100 mm wafers
|
* Maximum substrate size: 6"
* Minimum substrate size: 3*3 mm2
* maximum substrate thickness: 4 mm
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*Allowed material 2
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*Allowed material 2
*Allowed material 3
|style="background:WhiteSmoke; color:black"|
*Silicon
*Glass
|
*III-V compound semiconductors
*Si, SiO2, SOI
|-
|}
<br clear="all" />
== KS Aligner ==
== EVG Aligner ==
== III-V Aligner ==
==Inclined UV lamp==
==Inclined UV lamp==
[[Image:Inclined UV lamp_1.jpg|200×200px|right|thumb|Inclined UV lamp is placed in Cleanroom 13.]]
[[Image:Inclined UV lamp_1.jpg|200×200px|right|thumb|Inclined UV lamp is placed in Cleanroom 13.]]

Revision as of 10:32, 9 August 2013

UV Exposure Comparison Table

Equipment KS Aligner EVG Aligner III-V Aligner Inclined UV Lamp
Purpose
  • Spinning and baking of AZ5214E resist
  • Spinning and baking of AZ4562 resist
  • Spinning and baking of e-beam resist
  • Spinning and baking of AZ5214E resist
  • Spinning and baking of AZ4562 resist
  • Spinning and baking of SU8 resist
  • In-line substrate HMDS priming
  • Coating and baking of AZ MiR 701 (29cps) resist
  • Coating and baking of AZ nLOF 2020 resist
  • Post-exposure baking at 110°C
Performance Substrate handling
  • Cassette-to-cassette
  • Edge handling chuck
  • Single substrate
  • Non-vacuum chuck for fragile substrates
  • Cassette-to-cassette
 Single substrate
Permanent media
  • AZ5214E resist
  • AZ4562 resist
  • Acetone for chuck cleaning
  • Acetone for drip pan
  • AZ5214E resist
  • PGMEA for edge bead removal
  • Acetone for chuck cleaning
  • AZ MiR 701 (29cps) resist
  • AZ nLOF 2020 resist
  • PGMEA for backside rinse and edge-bead removal
  • PGMEA for spinner bowl cleaning and vapor tip bath
Manual dispense option
  • 2 automatic syringes
  • yes
  • pneumatic dispense for SU8 resist
  • no
Process parameter range Spindle speed
  • Range
  • Range
  • 10 - 9990 rpm
  • 10-5000 rpm
Parameter 2
  • Range
  • Range
  • Range
Substrates Batch size
  • 24 50 mm wafers
  • 24 100 mm wafers
  • 24 150 mm wafers
  • 1 100 mm wafer
  • 1 150 mm wafer
  • 25 100 mm wafers
  • Maximum substrate size: 6"
  • Minimum substrate size: 3*3 mm2
  • maximum substrate thickness: 4 mm
Allowed materials
  • Allowed material 1
  • Allowed material 2
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3
  • Silicon
  • Glass
  • III-V compound semiconductors
  • Si, SiO2, SOI


KS Aligner

EVG Aligner

III-V Aligner

Inclined UV lamp

Inclined UV lamp is placed in Cleanroom 13.

The Inclined UV lamp is 1000 W Hg(Xe)lamp source designed for near UV, 350-450nm, mid UV, 260-320nm, and deep UV, 220-260nm exposures of resists and polymers. The exposure source can be also used to make an inclined exposure in air or in the media tank.

The toll was purchased in February 2009 from Newport company. The exposure lamp has a official name: Oriel Flood Exposure Source, unit 92540. All other parts of equipment: substrate and mask holder with media tank, exhaust box around the tool, timer controller, were designed and build at Danchip workshop.

The substrate and mask holder with a media tank was designed as part of Master Thesis of DTU Nanotech, Andres Kristensen group. The exhaust box was made as part of safety and the timer controller was build to control exposure time.

The technical specification and the general outline of the equipment can be found in LabManager.

The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager: Equipment info in LabManager

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