Specific Process Knowledge/Thin film deposition/Electroplating-Ni

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Name of equipment

Write a short description of the equipment(s).

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

File:Cluster1.jpg

Image(s) of the equipment(s)

LabManager

Process information

Link to process pages - e.g. one page for each material

Example:

• Etch of silicon using RIE
• Etch of silicon oxide using RIE
• Etch of silicon nitride using RIE
• Etch of photo resist using RIE

Equipment performance and process related parameters

Equipment		Equipment 1	Equipment 2
Purpose		Purpose 1 Purpose 2	Purpose 1 Purpose 2 Purpose 3
Performance	Response 1	Performance range 1 Performance range 2	Performance range 1 Performance range 2 Performance range 3
	Response 2	Performance range	Performance range
Process parameter range	Parameter 1	Range	Range
	Parameter 2	Range	Range
Substrates	Batch size	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers
	Allowed materials	Allowed material 1 Allowed material 2	Allowed material 1 Allowed material 2 Allowed material 3