Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide: Difference between revisions
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At DANCHIP you can also deposit silicon oxide using [[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]], [[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]] or IBE Ionfab300 | At DANCHIP you can also deposit silicon oxide using [[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]], [[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]] or IBE Ionfab300 | ||
sputter systems. One of the advantages here is that you can deposit on any material you like. | sputter systems. One of the advantages here is that you can deposit on any material you like. | ||
*[[/Deposition of Silicon Oxide using Lesker sputter tool|Deposition of Silicon Oxide using PVD co-sputter/evaporation tool]] | |||
*[[/Deposition of Silicon Oxide using Lesker sputter tool|Deposition of Silicon Oxide using Lesker sputter tool]] | *[[/Deposition of Silicon Oxide using Lesker sputter tool|Deposition of Silicon Oxide using Lesker sputter tool]] | ||