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Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions

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Bureaucrats, danchip, Administrators
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Jml (talk | contribs)
Bureaucrats, danchip, Administrators
1,918 edits
Line 62: Line 62:
! width="120" | Mask material
! width="120" | Mask material
! width="120" | Etch load
! width="120" | Etch load
! width="120" | sice
! width="120" | Comments
|-
|-
! [[Specific Process Knowledge/Etch/DRIE-Pegasus/processA|Process A]]
! [[Specific Process Knowledge/Etch/DRIE-Pegasus/processA|Process A]]
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| Photo resist
| Photo resist
| 12-13 % on 6" wafer
| 12-13 % on 6" wafer
| asf
|  
| Fast ettw
|  
|-
|-
|}
|}
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