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=Aligner: MA6-1=
=Aligner: MA6-1=
[[Image:KSAligner in E-4.jpg|400px|thumb|The Aligner: MA6-1 is located in PolyFabLab.]]
[[File:KSAligner in E-4.jpg|400px|thumb|The Aligner: MA6-1 is located in PolyFabLab.]]


SUSS Mask Aligner MA6 is designed for high resolution photolithography.
'''Tool description'''<br>
The 365nm exposure wavelength version is capable of 1.25 (1.0) um resolution in vacuum contact. All contact exposure programs (vacuum, hard, soft, proximity) are supplied.
The Aligner: MA6-1 is a manual UV exposure system, which can be used for mask alignment and exposure of UV resists on 100 mm substrates. It is also capable of flood exposing chips, 50 mm and 150 mm substrates.
Two alignment options are available: top side alignment (TSA) with a split field or a video microscope and back side alignment (BSA) with BSA microscope. It is also possible to make IR- light alignment.


{| class="wikitable"
! style="text-align:left" | Product:
| style="padding-left: 10px" | Süss mask aligner MA6
|-
! style="text-align:left" | Year of purchase:   
| style="padding-left: 10px" | 1999
|-
! style="text-align:left" | Location:
| style="padding-left: 10px" | Cleanroom E-4
|}


'''Training videos:'''  
'''User manual'''<br>
<br/>The training videos were made for MA6-2, but operation of MA6-1 is very similar as they are exactly the same model. Due to a different power supply, however, procedures for ignition and intensity control of the lamp is different for MA6-1. Please refer to the manual for the correct procedures.  
The user manual and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=44 LabManager] - '''requires login'''
 
'''Tool training'''<br>
Training on the tool requires users to complete the [https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography#Lithography_Tool_Package_Training lithography TPT] followed by reading the manual and watching the training videos. The tool authorization can be obtained after a successful hands-on authorization training session.<br>
 
The training videos were made for MA6-2, but operation of MA6-1 is very similar as they are exactly the same model. Due to a different power supply, however, procedures for ignition and intensity control of the lamp is different for MA6-1. Please refer to the manual for the correct procedures.  


[https://www.youtube.com/watch?v=o8IBtfQHNzU Operation]
[https://www.youtube.com/watch?v=o8IBtfQHNzU Operation]


[https://www.youtube.com/watch?v=rvUuXYgw-xU Alignment]
[https://www.youtube.com/watch?v=rvUuXYgw-xU Alignment]
<br clear="all" />
=Equipment performance and process related parameters=
{| class="wikitable"
|-
! scope=row style="text-align: left;" | Purpose
| Alignment and UV exposure
|-
! scope=row style="text-align: left;" | Exposure modes
|
*Vacuum contact
*Hard contact
*Soft contact
*Proximity
*Flood exposure
|-
! scope=row style="text-align: left;" | Exposure light/filters
|
*365 nm (i-line)
*broadband (i-, g-, h-lines), requires tool change
*303 nm, requires tool change
|-
! scope=row style="text-align: left;" | Minimum resolution
| ~1.25 µm
|-
! scope=row style="text-align: left;" | Mask size
| 5x5 inches
|-
! scope=row style="text-align: left;" | Alignment modes
|
*Top side (TSA): ±2 µm
*Back side (BSA): ±5 µm
|-
! scope=row style="text-align: left;" | Substrate size
|
*Mask exposure and alignment: 100 mm wafers
*Flood exposure: from samples to 150 mm wafers
|-
! scope=row style="text-align: left;" | Allowed materials
| All PolyFabLab allowed materials
|-
! scope=row style="text-align: left;" | Substrate batch
| 1
|}
<br clear="all" />


The user manual(s), quality control procedure(s) and results, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=44 LabManager]  - '''requires login'''
=Process information=
The Aligner: MA6-1 has an i-line notch filter installed. This results in an exposure light peak around 365nm with a FWHM of 7nm.  


==Exposure dose==
==Exposure dose==
[[Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseMaskAligners#Aligner:_MA6-1|Information on UV exposure dose]]
[[Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseMaskAligners#Aligner:_MA6-1|Information on UV exposure dose]]


==Process information==
==Alignment mark design and locations==
The Aligner: MA6-1 has an i-line notch filter installed. This results in an exposure light peak around 365nm with a FWHM of 7nm.
[[Specific_Process_Knowledge/Pattern_Design#Alignment_marks|Alignment mark design and locations]].
 
Link to information about [[Specific_Process_Knowledge/Pattern_Design#Alignment_marks|alignment mark design and locations]].


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Line 66: Line 126:
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|}
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==Equipment performance and process related parameters==
{| class="wikitable"
|-
! scope=row style="text-align: left;" | Purpose
| Alignment and UV exposure
|-
! scope=row style="text-align: left;" | Exposure modes
|
*Vacuum contact
*Hard contact
*Soft contact
*Proximity
*Flood exposure
|-
! scope=row style="text-align: left;" | Exposure light/filters
|
*365 nm (i-line)
*broadband (i-, g-, h-lines), requires tool change
*303 nm, requires tool change
|-
! scope=row style="text-align: left;" | Minimum resolution
| ~1.25 µm
|-
! scope=row style="text-align: left;" | Mask size
| 5x5 inches
|-
! scope=row style="text-align: left;" | Alignment modes
|
*Top side (TSA): ±2 µm
*Back side (BSA): ±5 µm
|-
! scope=row style="text-align: left;" | Substrate size
|
*Mask exposure and alignment: 100 mm wafers
*Flood exposure: from samples to 150 mm wafers
|-
! scope=row style="text-align: left;" | Allowed materials
| All PolyFabLab allowed materials
|-
! scope=row style="text-align: left;" | Substrate batch
| 1
|}
<br clear="all" />

Revision as of 14:44, 25 June 2026

Aligner: MA6-1

The Aligner: MA6-1 is located in PolyFabLab.

Tool description
The Aligner: MA6-1 is a manual UV exposure system, which can be used for mask alignment and exposure of UV resists on 100 mm substrates. It is also capable of flood exposing chips, 50 mm and 150 mm substrates.

Product: Süss mask aligner MA6
Year of purchase: 1999
Location: Cleanroom E-4

User manual
The user manual and contact information can be found in LabManager - requires login

Tool training
Training on the tool requires users to complete the lithography TPT followed by reading the manual and watching the training videos. The tool authorization can be obtained after a successful hands-on authorization training session.

The training videos were made for MA6-2, but operation of MA6-1 is very similar as they are exactly the same model. Due to a different power supply, however, procedures for ignition and intensity control of the lamp is different for MA6-1. Please refer to the manual for the correct procedures.

Operation

Alignment

Equipment performance and process related parameters

Purpose Alignment and UV exposure
Exposure modes
  • Vacuum contact
  • Hard contact
  • Soft contact
  • Proximity
  • Flood exposure
Exposure light/filters
  • 365 nm (i-line)
  • broadband (i-, g-, h-lines), requires tool change
  • 303 nm, requires tool change
Minimum resolution ~1.25 µm
Mask size 5x5 inches
Alignment modes
  • Top side (TSA): ±2 µm
  • Back side (BSA): ±5 µm
Substrate size
  • Mask exposure and alignment: 100 mm wafers
  • Flood exposure: from samples to 150 mm wafers
Allowed materials All PolyFabLab allowed materials
Substrate batch 1


Process information

The Aligner: MA6-1 has an i-line notch filter installed. This results in an exposure light peak around 365nm with a FWHM of 7nm.

Exposure dose

Information on UV exposure dose

Alignment mark design and locations

Alignment mark design and locations.


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