Specific Process Knowledge/Lithography/Aligners/MAvsMLA: Difference between revisions
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! width=" | ! width="420" | | ||
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|+'''Wafer maps at optimal processing conditions for different aligners''' | |+'''Wafer maps at optimal processing conditions for different aligners''' | ||
|- border="0" align="center" | |- border="0" align="center" | ||
|[[Image:Map_MLA2_D90_F2.jpg| | |[[Image:Map_MLA2_D90_F2.jpg|400px]] | ||
|[[Image:Map_MA6-2_vacuum.jpg| | |[[Image:Map_MA6-2_vacuum.jpg|400px]] | ||
|[[Image:Map_MA6-1_vacuum.jpg| | |[[Image:Map_MA6-1_vacuum.jpg|400px]] | ||
|- align="center" | |- align="center" | ||
| Aligner: Maskless 02 (MLA2). || Aligner: MA6-2 || Aligner: MA6-1 | | Aligner: Maskless 02 (MLA2) (Dose 90mJ/cm<sup>2</sup>; defoc 2). <br/>Resolution: 1.22µm average; 0.1µm standard deviation. <br/>Yield at 1.25µm: 99% || Aligner: MA6-2 (Dose 100mJ/cm<sup>2</sup>; vacuum contact) <br/>Resolution: 1.02µm average; 0.1µm standard deviation. <br/>Yield at 1.25µm: 100% || Aligner: MA6-1 (Dose 100mJ/cm<sup>2</sup>; vacuum contact) <br/>Resolution: 1.30µm average; 0.2µm standard deviation. <br/>Yield at 1.25µm: 59% | ||
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