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{{cc-nanolab}}
{{cc-nanolab}}


=Developer TMAH UV-lithography=
=Developer: TMAH UV-lithography=
[[file:SUSS DEV.JPG|400px|right|thumb|Developer: TMAH UV-lithography is located in E-4.]]


[[Image:SUSS DEV.JPG|400px|right|thumb|Developer: TMAH UV-lithography is located in E-4.]]
'''Tool description'''<br>
The Developer TMAH UV-lithography is a fully automatic and programmable cassette-to-cassette system, which can be used for post-exposure baking and development of UV resists on 100 mm and 150 mm substrates. The development is done using AZ 726 MIF, which is a 2.38% TMAH solution with wetting agent.


Developer TMAH UV-lithography was released Q4 2014.
The developer dispense, puddle time, agitation, rinse and drying is controlled by the tool.


{| class="wikitable"
! style="text-align:left" | Product:
| style="padding-left: 10px" | Süss MicroTec Gamma 2M developer
|-
! style="text-align:left" | Year of purchase:   
| style="padding-left: 10px" | 2014
|-
! style="text-align:left" | Location:
| style="padding-left: 10px" | Cleanroom E-4
|}
'''Chuck size and lift pins'''<br>
Link to information about [[Specific_Process_Knowledge/Pattern_Design#Helpful_information_for_chip_layout|developer chuck size and hotplate pin positions]].
Link to information about [[Specific_Process_Knowledge/Pattern_Design#Helpful_information_for_chip_layout|developer chuck size and hotplate pin positions]].


'''[https://www.youtube.com/watch?v=fs9DRH0Eo3k Training video]'''
'''User manual'''<br>
The user manual and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=329 LabManager] - '''requires login'''


 
'''Tool training'''<br>
The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=329 LabManager] - '''requires login'''
Training on the tool requires users to complete the [https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography#Lithography_Tool_Package_Training lithography TPT] followed by the online tool training and a hands-on authorization training.<br>
 
The tool training video is part of the online tool training, but can also be viewed [https://www.youtube.com/watch?v=fs9DRH0Eo3k here].
=Process Information=
<br clear="all" />
*[[Specific Process Knowledge/Lithography/Development/Developer_TMAH_UV-lithography_processing|General process information]]
*[[Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography_processing#Process recommendations|Process recommendations]]
*[[Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography processing#Standard Processes|Standard processes]]


=Equipment performance and process related parameters=
=Equipment performance and process related parameters=
 
{| class="wikitable"
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
|-
 
! scope=row style="text-align: left;" | Tool purpose
!style="background:silver; color:black;" width="60"|Purpose
|
|style="background:LightGrey; color:black"|
Development of:
|style="background:WhiteSmoke; color:black"|
*AZ nLOF 2020
Development of
*AZ MIR 701
*AZ nLOF
*AZ MiR 701
*AZ 5214E
*AZ 5214E
*AZ 4562
*AZ 4562
*DUV resists
Development of DUV resists:
*KrF M230Y
*KrF M35G
|-
|-
!style="background:silver; color:black;" width="60"|Developer  
! scope=row style="text-align: left;" | Developer
|style="background:LightGrey; color:black"|
| AZ 726 MIF (2.38% TMAH)
|style="background:WhiteSmoke; color:black" |
|-
AZ 726 MIF
! scope=row style="text-align: left;" | Development method
 
| Puddle
(2.38% TMAH in water)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Method
! scope=row style="text-align: left;" | Handling method
|style="background:LightGrey; color:black"|Development
|
|style="background:WhiteSmoke; color:black"|
*Vvacuum chuck for 100 mm & 150 mm wafers
Puddle
|-
|-
|style="background:LightGrey; color:black"|Handling
! scope=row style="text-align: left;" | Process temperature
|style="background:WhiteSmoke; color:black"|
| Room temperature
Vacuum chuck
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
! scope=row style="text-align: left;" | Process agitaion
|style="background:LightGrey; color:black"|Temperature
| 1 cycles per 30 seconds
|style="background:WhiteSmoke; color:black"|
Room temperature
|-
|-
|style="background:LightGrey; color:black"|Agitation
! scope=row style="text-align: left;" | Process rinse
|style="background:WhiteSmoke; color:black"|
| DI water
Rotation
|-
|-
|style="background:LightGrey; color:black"|Rinse
! scope=row style="text-align: left;" | Substrate sizes
|style="background:WhiteSmoke; color:black"|
|  
DI water
*100 mm wafers
*150 mm wafers
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row style="text-align: left;" | Substrate materials
|style="background:LightGrey; color:black"|Substrate size
|
|style="background:WhiteSmoke; color:black"|
*Silicon or glass substrates
* 100 mm wafers
*Film, or pattern, of all materials except Type IV
* 150 mm wafers
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
! scope=row style="text-align: left;" | Substrate batch size
|style="background:WhiteSmoke; color:black"|
| 1-25
Silicon and glass substrates
 
Film or pattern of all except Type IV
|-
|-
|style="background:LightGrey; color:black"|Batch
! scope=row style="text-align: left;" | Media flow rates
|style="background:WhiteSmoke; color:black"|
|
1-25
|-  
!style="background:silver; color:black;" width="60"|Media flow rates
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*AZ 726 MIF (TMAH): 230 ml/min
*AZ 726 MIF (TMAH): 230 ml/min
*Topside rinse DI water: 400 ml/min (with BSR+CR active)
*Topside rinse DI water: 400 ml/min (with BSR+CR active)
*Backside rinse DI water: 55 ml/min (with TSR+CR active)
*Backside rinse DI water: 55 ml/min (with TSR+CR active)
*Process Nitrogen: 50 l/min
*Process Nitrogen: 50 l/min
|-
|}
|}
<br clear="all" />
<br clear="all" />
=Process information=
*[[Specific Process Knowledge/Lithography/Development/Developer_TMAH_UV-lithography_processing|General process information]]
*[[Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography_processing#Process recommendations|Process recommendations]]
*[[Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography processing#Standard Processes|Standard processes]]
<br clear="all"/>
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