Specific Process Knowledge/Lithography/Development/manualTMAH developer: Difference between revisions
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Training on the tool requires users to complete the [https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography#Lithography_Tool_Package_Training lithography TPT] followed by the online tool training. The tool training video can also be viewed [https://www.youtube.com/watch?v=btinNzYnLnY here]. | Training on the tool requires users to complete the [https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography#Lithography_Tool_Package_Training lithography TPT] followed by the online tool training. The tool training video can also be viewed [https://www.youtube.com/watch?v=btinNzYnLnY here]. | ||
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=Equipment performance and process related parameters= | |||
{| class="wikitable" | |||
|- | |||
! scope=row style="text-align: left;" | Tool purpose | |||
| | |||
Development of UV resists: | |||
*AZ nLOF 2020 | |||
*AZ MIR 701 | |||
*AZ 5214E | |||
*AZ 4562 | |||
Development of DUV resists: | |||
*KrF M230Y | |||
*KrF M35G | |||
|- | |||
! scope=row style="text-align: left;" | Developer | |||
| AZ 726 MIF (2.38% TMAH) | |||
|- | |||
! scope=row style="text-align: left;" | Development method | |||
| Puddle | |||
|- | |||
! scope=row style="text-align: left;" | Handling method | |||
| | |||
*Non-vacuum chuck for 100 mm & 150 mm wafers | |||
*Non-vacuum chuck for chips and 50 mm wafers | |||
|- | |||
! scope=row style="text-align: left;" | Process temperature | |||
| Room temperature | |||
|- | |||
! scope=row style="text-align: left;" | Process agitaion | |||
| 15 cycles per minute | |||
|- | |||
! scope=row style="text-align: left;" | Process rinse | |||
| DI water | |||
|- | |||
! scope=row style="text-align: left;" | Substrate sizes | |||
| | |||
*Chips | |||
*50 mm wafers | |||
*100 mm wafers | |||
*150 mm wafers | |||
|- | |||
! scope=row style="text-align: left;" | Substrate materials | |||
| | |||
*All cleanroom allowed materials | |||
*Film, or pattern, of all materials except Type IV | |||
|- | |||
! scope=row style="text-align: left;" | Substrate batch size | |||
| 1 | |||
|} | |||
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=Process information= | =Process information= | ||
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! scope=row style="text-align: left;" | Developer | ! scope=row style="text-align: left;" | Developer | ||
| colspan="2"|AZ 726 MIF (2.38% TMAH) | | colspan="2"|AZ 726 MIF (2.38% TMAH) | ||
|} | |} | ||
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